Z0109MN

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© NXP B.V. 2011. All rights reserved.

Product data sheet

Rev. 05 — 22 March 2011

6 of 15

NXP Semiconductors

Z0109MN

4Q Triac

5.

Thermal characteristics

Table 5.

Thermal characteristics

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

thermal resistance from

junction to solder point

full cycle; see Figure 8

--15

K/W

thermal resistance from

junction to ambient

full cycle; printed circuit board

mounted; minimum footprint;

see Figure 6

-

156

-

K/W

full cycle; printed circuit board

mounted; pad area; see Figure 7

-70

-K/W

All dimensions are in mm

All dimensions are in mm

Printed circuit board:

FR4 epoxy glass (1.6 mm thick), copper laminate

(35 um thick)

Fig 6.

Minimum footprint SOT223

Fig 7.

Printed circuit board pad area: SOT223

001aab508

3.8 min

1.5

min

1.5

min

(3

×)

2.3

4.6

6.3

1.5

min

001aab509

7

4.6

15

36

9

10

18

4.5

60

50