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ALLEGRO |
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6 7 8 9 2 3 4 5 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 20 40 60 80 100 120 140 160 180 Temperature (ºC) Power Derating Curve (RθJA = 228 ºC/W) 1-layer PCB, Package LH (RθJA = 110 ºC/W) 2-layer PCB, Package LH (RθJA = 165 ºC/W) 1-layer PCB, Package UA VCC(min) VCC(max) 0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300 1400 1500 1600 1700 1800 1900 20 40 60 80 100 120 140 160 180 Temperature (°C) Power Dissipation versus Ambient Temperature (R θJA = 165 ºC/W) 1-lay er PC B, Packa ge UA (R θJA = 228 ºC/W ) 1-lay er PCB, Package LH (R θJ A = 110 ºC/ W) 2-l ayer PCB, Packag e LH Thermal Characteristics may require derating at maximum conditions, see application information Characteristic Symbol Test Conditions* Value Unit Package Thermal Resistance RθJA Package LH, on 1-layer PCB with copper limited to solder pads 228 ºC/W Package LH, on 2-layer PCB with 0.463 in.2 of copper area each side 110 ºC/W Package UA, on 1-layer PCB with copper limited to solder pads 165 ºC/W *Additional thermal information available on the Allegro website Chopper-Stabilized, Two Wire Hall-Effect Switches A1150, A1152, A1153, A1155, A1156, A1157, and A1158 4 Allegro MicroSystems, Inc. 115 Northeast Cutoff Worcester, Massachusetts 01615-0036 U.S.A. 1.508.853.5000; www.allegromicro.com |