TSL4531

DIGITAL AMBIENT LIGHT SENSOR

TAOS112 − OCTOBER 2011

11

The LUMENOLOGY

r Company

r

r

Copyright

E 2011, TAOS Inc.

www.taosinc.com

HARDWARE APPLICATION INFORMATION

Power Supply Decoupling

The power supply lines must be decoupled with a 0.1-

μF capacitor placed as close to the device package as

possible. The bypass capacitor should have low effective series resistance (ESR) and effective series

inductance (ESI), such as the common ceramic types, which provide a low impedance path to ground at high

frequencies to handle transient currents caused by internal logic switching.

PCB Pad Layout

Suggested PCB pad layout guidelines for the CL package is shown in Figure 8.

0.70

1.35

1.2

0.85

0.95

0.55

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

Figure 8. Suggested CL Package PCB Layout