 |
 |
|
| CC1100ERTKT |
|
|||||||||||||||||
 TI
|
| |||||||||||||||||
|
23 page 
CC1100E SWRS082 Page 23 of 92 100%. See Figure 8 for top solder resist and top paste masks. Each decoupling capacitor should be placed as close as possible to the supply pin it decouples. Each decoupling capacitor should be connected to the power line (or power plane) by separate vias. The best routing is from the power line (or power plane) to the decoupling capacitor and then to the CC1100E supply pin. Supply power filtering is very important. Each decoupling capacitor ground pad should be connected to the ground plane by separate vias. Direct connections between neighboring power pins will increase noise coupling and should be avoided unless absolutely necessary. Routing in the ground plane underneath the chip or the balun/RF matching circuit, or between the chip’s ground vias and the decoupling capacitor’s ground vias should be avoided. This improves the grounding and ensures the shortest possible current return path. The external components should ideally be as small as possible (0402 is recommended) and surface mount devices are highly recommended. Please note that components with different sizes than those specified may have differing characteristics. Precaution should be used when placing the microcontroller in order to avoid noise interfering with the RF circuitry. A CC1100E DK Development Kit with a fully assembled CC1100E EM Evaluation Module is available. It is strongly advised that this reference layout is followed very closely in order to get the best performance. The schematic, BOM and layout Gerber files are all Figure 8: Left: Top Solder Resist Mask (Negative). Right: Top Paste Mask. Circles are Vias 8 Configuration Overview The CC1100E can be configured to achieve optimum performance for many different applications. Configuration is done using the SPI interface. See Section 10 below for more description of the SPI interface. The following key parameters can be programmed: Power-down / power up mode Crystal oscillator power-up / power-down Receive / transmit mode RF channel selection Data rate Modulation format RX channel filter bandwidth RF output power Data buffering with separate 64-byte receive and transmit FIFOs Packet radio hardware support Forward Error Correction (FEC) with interleaving Data whitening Wake-On-Radio (WOR) Details of each configuration register can be Figure 9 shows a simplified state diagram that explains the main CC1100E states together with typical usage and current consumption. For detailed information on controlling the CC1100E state machine, and a complete state diagram, see Section 19, starting on page |
