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CCCCC-DXN-XHHKKMN3 Datasheet(PDF) 11 Page - Marktech Corporate |
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CCCCC-DXN-XHHKKMN3 Datasheet(HTML) 11 Page - Marktech Corporate |
11 / 12 page 11 CLD-CT979.003 Cree, Inc. 4600 Silicon Drive Durham, NC 27703 USA Tel: +1.919.313.5300 Fax: +1.919.313.5778 www.cree.com/ledlamps Copyright © 2009 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree and the Cree logo are registered trademarks of Cree, Inc. Soldering & Handling 1. Cleaning • Don’tuseunspecifiedchemicalliquidstocleantheSMDLED;thechemicalcouldharmtheSMDLED.When washing is necessary, please immerse the SMD LED in alcohol at normal room temperature for less than 1 minute and dry at normal room temperature for 15 minutes before use. • TheinfluenceofultrasoniccleaningontheSMDLEDdependingonfactorssuchasultrasonicpowerandtheway SMDLEDaremounted.Ultrasoniccleaningshallbepre-qualifiedtoensurethiswillnotcausedamagetothe SMD LED. 2. Moisture-Proof Packing • In order to prevent moisture absorption into SMD LED during the transportation and storage, SMD LED is packed in a moisture barrier bag. Desiccants and a humidity indicator are packed together with SMD LED as the secondary protection. The indication of humidity indicator card provides the information of humidity within SMD packing. 3. Storage • Shelflifeinoriginalsealedbagatstorageconditionof<40ºCand<90%RHis12months.Bakingisrequired whenever shelf life is expired. • Before openning the packaging , Please check whether bag leak air or not. • Afterbagopening,theSMDLEDmustbestoredunderthecondition<30ºCand<60%RH.Underthiscondition, SMDLEDmustbeused(subjecttoreflow)within168hoursafterbagopening,andre-bakingisrequiredwhen exceeding 168 hours. • Forbaking,placeSMDLEDinovenattemperature80ºC±5ºCandrelativehumidity<=10%RH,for24hours. • Take out the material from packaging bag for re-bake. Do not open the door of oven frequently during the baking process. 4. Soldering • Manual soldering by soldering iron • The use of a soldering iron of less than 25W is recommended and the temperature of the iron must be kept at below 315ºC, with soldering time within 2 seconds. • The epoxy resin of SMD LED should not be in contact with tip of soldering iron. • No mechanical stress should be exerted on the resin portion of SMD LED during soldering. • Handling of SMD LED should be done when the package has been cooled down to below 40ºC or less. This is to prevent the SMD LED failures due to thermal-mechanical stress during handling. • ReflowSoldering:Thetemperature(topsurfaceofSMDLED)profileisasbelow: Melting-point Pre-heat Soak Reflow Cooling Time Heat Sink Solder = Lead-free Average ramp-up rate = 4ºC/s max Peak temperature = 250ºC max. Preheat temperature = 150ºC ~200ºC Time within 5ºC of actual Peak Temperature = 10s max. Preheat time = 100s max. Duration above 217ºC is 80s max. Ramp-down rate = 6ºC/s max. |
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