SUPERWORLD ELECTRONICS (S) PTE LTD

PG. 5

7. RELIABILITY & TEST CONDITION :

Bending

40(1.575)

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

Flexture Strength

100(3.937)

45(1.772)

right conditions.

45(1.772)

20(.787)

Solder a chip on a test substrate, bend the substrate

by 2mm (0.079in) and return.

TEST CONDITION

PERFORMANCE

not be damaged by the forces applied on the

The terminal electrode & the dielectric must

More than 95% of the terminal electrode

Refer to standard electrical characteristics list

10± 0.5

seconds

60

seconds

Terminal Strength

Solderability

right conditions.

W

should be covered with solder.

60

seconds

Preheating

245° C

150° C

4± 1.0

seconds

cooling

Dipping

Natural

Solder Heat Resistance

Temperature Rise Test

Electrical Characteristics Test

Rated Current

Inductance (Ls)

Preheating

260° C

150° C

Dipping

cooling

Natural

Solder : Sn-Cu0.5

Flux for lead free: ROL0

Dip Time : 4± 1sec.

Preheat : 150° C, 60sec.

Solder Temperature : 245± 5° C

2. Temperature measured by digital surface thermometer.

Flux for lead free: ROL0

Dip Time : 10± 0.5sec.

Preheat : 150° C, 60sec.

Solder : Sn-Cu0.5

Solder Temperature : 260± 5° C

1. Applied the allowed DC current.

Agilent E4991

No mechanical damage.

Remaining terminal electrode : 75% min.

ITEM

Rated Current < 1A ΔT 20°C Max

Rated Current

1A ΔT 40°C Max

≧

DC Power Supply

Over Rated Current requirements, there will be some risk

Q Factor

Agilent4287

DC Resistance

Agilent 4338

Agilent16192

The duration of the applied forces shall be 60

(+ 5) Sec.

For L Series :

1.0

5

6

7

1.0

1.5

2

3

4

0.6

0.5

1.0

> 30

Size

Force (Kfg)

Time (sec)

10.2

High Frequency Chip Inductor

L1M SERIES

10.11.2011

NOTE : Specifications subject to change without notice. Please check our website for latest information.