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MIC5162 Datasheet(PDF) 7 Page - Micrel Semiconductor

Part # MIC5162
Description  Dual Regulator Controller for DDR3 GDDR3/4/5 Memory and High-Speed Bus Termination
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC5162 Datasheet(HTML) 7 Page - Micrel Semiconductor

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Micrel, Inc.
MIC5162
March 2010
7
M9999-033110
Application Information
High
performance
memory
requires
high
speed
signaling. This means special attention must be paid to
maintain signal integrity. Bus termination provides a
means to increase signaling speed while maintaining
good signal integrity. An example of bus termination is
the Series Stub Termination Logic or SSTL. Figure 1 is
an example of an SSTL 2 single ended series parallel
terminated output. SSTL 2 is a JEDEC signaling
standard operating off a 2.5V supply. It consists of a
series resistor (RS) and a terminating resistor (RT).
Values of RS range between 10
to 30
with a typical of
22 , while RT ranges from 22
to 28
with a typical
value of 25 . VREF must maintain 1/2 VDD with a ±1%
tolerance, while VTT will dynamically sink and source
current to maintain a termination voltage of ±40mV from
the VREF line under all conditions. This method of bus
termination reduces common mode noise, settling time,
voltage swings, EMI/RFI and improves slew rates.
The MIC5162 is a high performance linear controller,
utilizing scalable N-Channel MOSFETs to provide
JEDEC-compliant
bus
termination.
Termination
is
achieved by dividing down the VDDQ voltage by half,
providing the reference (VREF) voltage. An internal error
amplifier compares the termination voltage (VTT) and
VREF, controlling 2 external N-Channel MOSFETs to sink
and source current to maintain a termination voltage
(VTT) equal to VREF. The N-Channels receive their
enhancement voltage from a separate VCC pin on the
device.
Although this document focuses mostly on SSTL, the
MIC5162 is also capable of providing bus terminations
for SCSI, GTL, HSTL, LV-TTL, Rambus, LV-PECL,
DDR, DDR2, DDR3 memory termination and other
systems.
Figure 1. SSTL-2 Termination
VDDQ
The VDDQ pin on the MIC5162 provides the source
current through the high-side N-Channel and the
reference voltage to the device. The MIC5162 can
operate at VDDQ voltages as low as 1.35V. Due to the
possibility of large transient currents being sourced from
this line, significant bypass capacitance will aid in
performance by improving the source impedance at
higher frequencies. Since the reference is simply VDDQ/2,
perturbations on the VDDQ will also appear at half the
amplitude on the reference. For this reason, low ESR
capacitors
such
as
ceramics
or
OS-CON
are
recommended on VDDQ.
VTT
VTT is the actual termination point. VTT is regulated to
VREF. Due to high speed signaling, the load current seen
by VTT is constantly changing. To maintain adequate
large signal transient response, large OS-CON and
ceramics
are
recommended
on
VTT. The proper
combination and placement of the OS-CON and ceramic
capacitors is important to reduce both ESR and ESL
such that high-current and high-speed transients do not
exceed the dynamic voltage tolerance requirement of
VTT. The larger OS-CON capacitors provide bulk charge
storage while the smaller ceramic capacitors provide
current during the fast edges of the bus transition. Using
several smaller ceramic capacitors distributed near the
termination resistors is typically important to reduce the
effects of PCB trace inductance.
VREF
Two resistors dividing down the VDDQ voltage provide
VREF (Figure 3). The resistors are valued at around
17k . A minimum capacitor value of 120pF from VREF to
ground is required to remove high frequency signals
reflected from the source. Large capacitance values
(>1500pF) should be avoided. Values greater than
1500pF slow down VREF and detract from the reference
voltage’s ability to track VDDQ during high speed load
transients.
Figure 2. MIC5162 as a DDR Memory Termination
for 3.5A Application


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