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MIC5167 Datasheet(PDF) 11 Page - Micrel Semiconductor

Part # MIC5167
Description  1MHz, 6A, Integrated Switch, High-Efficiency, Synchronous Buck DDR Memory Terminator
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

MIC5167 Datasheet(HTML) 11 Page - Micrel Semiconductor

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Micrel, Inc.
MIC5167
January 2012
11
M9999-012312-B
Application Information
DDR memory requires two power supplies, one for the
memory chip, referred to as VDDQ and the other for a
termination supply VTT, which is one-half VDDQ. With
memory speeds in excess of 300MHz, the memory
system bus must be treated as transmission lines. To
maintain good signal integrity the memory bus must be
terminated to minimize signal reflections. Figure 2 shows
the simplified termination circuit. Each control, address
and data lines have these termination resistors RS and
RT connected to them.
-
+
DDR
MEMORY
PVIN
SW
FB
22µF
x4
PGND
100µF
x3
SGND
SVIN
VDDQ
EP
VREF
100pF
0.4µH
RT
RS
VIN
5.0V
VDDQ
1.8V
MIC5167
-
+
CHIP SET
RT
RS
VDDQ
VDDQ
VDDQ
VTT/0.9V
VREF
+
Figure 2. DDR Memory Termination Circuit
Bus termination provides a means to increase signaling
speed while maintaining good signal integrity. The
termination network consists of a series resistor (RS)
and a terminating resistor (RT). Values of RS range
between 10Ω to 30Ω with a typical of 22Ω, while RT
ranges from 22Ω to 28Ω with a typical value of 25Ω. VTT
will dynamically sink and source current to maintain a
termination voltage under all conditions. This method of
bus termination reduces common mode noise, settling
time, voltage swings, EMI/RFI and improves slew rates.
VDDQ powers all the memory IC’s, memory drivers and
receivers for all the memory bits in the DDR memory
system. When the driver is logic low VTT sources current.
When the driver is logic high VTT sinks current. The
MIC5167 regulates VTT to VDDQ/2 during sourcing or
sinking current. The power dissipated in RS (bus
resistance) and RT (termination resistance) is VTT
squared divided by their respective resistance.
Since the voltage across the resistance is VDDQ/2, the
power dissipated is one-quarter the power of a
termination voltage of VDDQ. The memory bits are not
usually all at a logic high or logic low at the same time so
the VTT supply is usually not sinking or sourcing much
current.
VTT
VTT is regulated to VREF. Due to high speed signaling, the
load current seen by VTT is constantly changing. To
maintain adequate transient response, large OS-CON
and ceramics are recommended on VTT. The proper
combination and placement of the OS-CON and ceramic
capacitors is important to reduce both ESR and ESL
such that high-current and high-speed transients do not
exceed the dynamic voltage tolerance requirement of
VTT. The larger OS-CON capacitors provide bulk charge
storage while the smaller ceramic capacitors provide
current during the fast edges of the bus transition. Using
several smaller ceramic capacitors distributed near the
termination resistors is important to reduce the effects of
PCB trace inductance.
When VTT is sinking current, the external power supply
that powers the MIC5167 (PVIN) must be able to sink
current-to-ground; otherwise, the supply voltage will start
to increase. It is crucial that this external power supply
must also be able to source and sink current.
VDDQ
The VDDQ input on the MIC5167 is used to create the
internal reference voltage for VTT. The reference voltage
is generated from an internal resistor divider network of
two 60kΩ resistors, generating a reference voltage VREF
that is VDDQ/2. The VDDQ input should be Kelvin
connected as close as possible to the memory supply
voltage.
Since the reference is simply VDDQ/2, any perturbations
on VDDQ will also appear at half the amplitude on the
reference. For this reason, both ceramics and low-ESR
bulk capacitors such as OS-CON are recommended on
the VDDQ supply. This will aid in performance by
improving the source impedance over a wide frequency
range.
Feedback
The feedback (FB) pin provides the path for the error
amplifier to regulate VTT. The FB input must also be
Kelvin connected to the VTT bypass capacitors. If the FB
input is connected to close to the MIC5167, the IR drop
of the PCB trace can cause the VTT voltage at the
memory chip to be too low. Placing the MIC5167 as
close as possible to the DDR memory will improve the
load regulation performance.


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