Micrel, Inc.

SY88982L

December 2009

4

M9999-121009-A

hbwhelp@micrel.com or (408) 955-1690

Absolute Maximum Ratings

(1)

Lead Temperature (soldering, 20sec.) ...........+260°C

Operating Ratings

(2)

Package Thermal Resistance

(3)

QFN

(

θ

(

ψ

DC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply Current

Modulation current excluded

48

65

(4)

mA

Minimum Voltage Required at

the Driver Output (headroom) for

Proper Operation

0.6

V

Input Resistance (DIN+, DIN-)

45

50

55

Ω

Differential Input Voltage Swing

200

2400

/EN Low

0.8

V

/EN High

2

V

25

k

Ω

1.2

V

AC Electrical Characteristics

Symbol

Parameter

Condition

Min

Typ

Max

Units

Data Rate

NRZ

0.155

2.7

Gbps

Modulation Current

(5)

AC-coupled

10

90

mA

DC-coupled

10

70

(6)

mA

Modulation OFF Current

Current at MOD+ when the device is

disabled.

750

µA

Output Current Rise Time

Ω load

55

80

ps

Output Current Fall Time

= 60mA, 15Ω load

55

80

ps

Total Jitter

@2.5Gbps data rate

20

Pulse-Width Distortion

20

ps

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

ψ

JB

uses a 4-layer and

θ

5.

Load = 15Ω.

6. Assuming VCC = 3.0V, Laser bandgap voltage = 1V, laser package inductance = 1nH, laser equivalent ser

ies resistor = 5Ω, and damping

resistor = 10Ω.