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SY89540U Datasheet(PDF) 6 Page - Micrel Semiconductor |
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SY89540U Datasheet(HTML) 6 Page - Micrel Semiconductor |
6 / 14 page Micrel, Inc. SY89540U December 2007 M9999-120607-C hbwhelp@micrel.com or (408) 955-1690 6 Absolute Maximum Ratings (1) Supply Voltage (VCC) ..........................–0.5V to +4.0V Input Voltage (VIN) ..................................–0.5V to VCC CML Output Voltage (VOUT) .... VCC–1.0V to VCC+5.0V Termination Current (3) Source or sink current on VT .................. ±100mA Input Current Source or sink current on IN, /IN.............. ±50mA VREF-AC Current Source or sink current on VREF-AC............... ±2mA Lead Temperature (soldering, 20sec.) .............260°C Storage Temperature (Ts)............... –65°C to +150°C Operating Ratings (2) Supply Voltage (VCC).................. +2.375V to +2.625V Ambient Temperature (TA) ................ –40°C to +85°C Package Thermal Resistance (4) QFN ( θJA) Still-air ............................................................23°C/W QFN ( ψJB) Junction-to-board ...........................................12°C/W DC Electrical Characteristics (5) TA = –40°C to +85°C, unless otherwise noted. Symbol Parameter Condition Min Typ Max Units VCC Power Supply VCC = 2.5V 2.375 2.5 2.625 V ICC Power Supply Current No load, max. VCC. 200 280 mA RDIFF_IN Differential Input Resistance (IN-to-/IN) 80 100 120 Ω RIN Input Resistance (IN-to-VT, /IN-to-VT) 40 50 60 Ω VIH Input HIGH Voltage (IN, /IN) 1.2 VCC V VIL Input LOW Voltage (IN, /IN) 0 VIH–0.1 V VIN Input Voltage Swing (IN, /IN) See Figure 1a. 0.1 1.7 V VDIFF_IN Differential Input Voltage |IN, /IN| See Figure 1b. 0.2 V IN-to-VT Maximum Input Voltage |IN-to-VT| 1.28 V VREF-AC Reference Voltage VCC–1.3 VCC–1.2 VCC–1.1 V Notes: 1. Permanent device damage may occur if ratings in the “Absolute Maximum Ratings” section are exceeded. This is a stress rating only and functional operation is not implied for conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Due to limited drive capability use for input of the same package only. 4. Assumes exposed pad is soldered (or equivalent) to the device’s most negative potential on the PCB. Ψ JB uses a 4-layer θJA in still-air unless otherwise stated. 5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. |
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