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SY89838UMGTR Datasheet(PDF) 5 Page - Micrel Semiconductor |
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SY89838UMGTR Datasheet(HTML) 5 Page - Micrel Semiconductor |
5 / 16 page Micrel, Inc. SY89838U May 2008 M9999-051308-D hbwhelp@micrel.com or (408) 955-1690 5 Absolute Maximum Ratings (1) Supply Voltage (VCC) ...........................-0.5V to +4.0V Input Voltage (VIN) .................................. -0.5V to VCC Input Current Source or sink current on IN, /IN.............. ±50mA Termination Current Source or sink current on VT .................. ±100mA VREF-AC Source or sink current .......................... ±2mA Lead Temperature (soldering, 20 sec.) ..........+260°C Storage Temperature (Ts)..................–65°C to 150°C Operating Ratings (2) Supply Voltage (VCC).................. +2.375V to +2.625V Ambient Temperature (TA) ................ –40°C to +85°C Package Thermal Resistance (3) QFN ( θJA) Still-Air .....................................................35°C/W QFN ( ψJB) Junction-to-Board ....................................16°C/W DC Electrical Characteristics (4) TA = –40°C to +85°C, unless otherwise stated. Symbol Parameter Condition Min Typ Max Units VCC Power Supply 2.375 2.5 2.625 V ICC Power Supply Current No load, max. VCC 250 350 mA RIN Input Resistance (IN-to-VT) 45 50 55 Ω RDIFF_IN Differential Input Resistance (IN-to-/IN) 90 100 110 Ω VIH Input High Voltage (IN, /IN) 1.2 VCC V VIL Input Low Voltage (IN, /IN) 0 VIH–0.2 V VIN Input Voltage Swing (IN, /IN) See Figure 1a. Note 5 0.2 VCC V VDIFF_IN Differential Input Voltage Swing |IN-/IN| See Figure 1b. 0.4 V VIN_FSI Input Voltage Threshold that Triggers FSI 30 100 mV VT_IN IN-to-VT (IN, /IN) 1.8 V VREF-AC Output Reference Voltage VCC–1.3 VCC–1.2 VCC–1.1 V Notes: 1. Permanent device damage may occur if the absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. θJA and ψJB values are determined for a 4-layer board in still air, unless otherwise stated. 4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established. 5. VIN (max) is specified when VT is floating. |
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