Micrel, Inc.

SY89840U

February 2005

5

M9999-021705

Absolute Maximum Ratings

(1)

Continuous ......................................................... ±50mA

Surge................................................................ ±100mA

Termination Current

Source/Sink Current on IN, /IN.................................... ±50mA

Lead Temperature (soldering, 20 sec.) ..............................+260°C

Storage Temperature (Ts).................................... –65°C to 150

°C

Operating Ratings

(2)

.............................................................. +3.0V to +3.6V

Package Thermal Resistance

(3)

QFN (

Still-Air ............................................................... 60°C/W

QFN (

Junction-to-Board .............................................. 33°C/W

DC Electrical Characteristics

(4)

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

2.375

3.0

2.625

3.6

V

V

Power Supply Current

65

95

mA

Input Resistance

45

50

55

Ω

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

Input High Voltage

(IN, /IN)

1.2

V

Input Low Voltage

(IN, /IN)

0

V

Input Voltage Swing

(IN, /IN)

See Figure 1a. Note 5

0.1

V

Differential Input Voltage Swing

|IN-/IN|

See Figure 1b.

0.2

V

Input Voltage Threshold that Triggers

FSI

30

100

mV

(IN, /IN)

1.28

V

Output Reference Voltage

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not

implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions

for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

values are determined for a 4-layer board in still air unless otherwise stated.

4. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.