Micrel, Inc.

SY89858U

August 2007

M9999-082907-C

hbwhelp@micrel.com or (408) 955-1690

4

Absolute Maximum Ratings

(1)

Termination Current

Reference Current

(3)

Continuous ................................................. 50mA

Surge........................................................ 100mA

Lead Temperature (soldering, 20 sec.) ..........+260°C

Operating Ratings

(2)

......................................................+3.0V to +3.6V

Package Thermal Resistance

(4)

QFN (

θ

Still-Air ..................................................... 35°C/W

QFN (

ψ

Junction-to-Board .................................... 20°C/W

DC Electrical Characteristics

(5)

Symbol

Parameter

Condition

Min

Typ

Max

Units

Power Supply

2.375

2.5

2.625

V

3.0

3.3

3.6

V

Power Supply Current

95

150

mA

Input Resistance

45

50

55

Ω

Differential Input Resistance

(IN-to-/IN)

90

100

110

Ω

Input High Voltage

(IN, /IN)

Note 6

V

Input Low Voltage

(IN, /IN)

0

V

Input Voltage Swing

(IN, /IN)

See Figure 1a.

0.1

1.7

V

Differential Input Voltage Swing

|IN-/IN|

See Figure 1b.

0.2

V

(IN, /IN)

1.28

V

Output Reference Voltage

V

Notes:

1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is

not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum ratings

conditions for extended periods may affect device reliability.

2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.

3. Due to the limited drive capability use for input of the same package only.

4. Package Thermal Resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.

θ

ψ

5. The circuit is designed to meet the DC specifications shown in the above table after thermal equilibrium has been established.