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SX8663 Datasheet(PDF) 7 Page - Semtech Corporation |
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SX8663 Datasheet(HTML) 7 Page - Semtech Corporation |
7 / 64 page ADVANCED COMMUNICATIONS & SENSING Rev5 4 th August 2011 © 2011 Semtech Corp. www.semtech.com 7 SX8663 Capacitive Button Matrix (up to 36) and Proximity Controller with Individual LED Drivers and Buzzer Output 2 ELECTRICAL CHARACTERISTICS 2.1 Absolute Maximum Ratings Stresses above the values listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these, or any other conditions beyond the “Recommended Operating Conditions”, is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability . Parameter Symbol Min. Max. Unit Supply Voltage VDD -0.5 3.9 V Input voltage (non-supply pins) VIN -0.5 3.9 V Input current (non-supply pins) IIN 10 mA Operating Junction Temperature TJCT 125 °C Reflow temperature TRE 260 °C Storage temperature TSTOR -50 150 °C ESD HBM (Human Body model) (i) ESDHBM 3 kV Latchup (ii) ILU ± 100 mA Table 2 Absolute Maximum Ratings (i) Tested to JEDEC standard JESD22-A114 (ii) Tested to JEDEC standard JESD78 2.2 Recommended Operating Conditions Parameter Symbol Min. Max. Unit Supply Voltage VDD 2.7 3.6 V Supply Voltage Drop (iii, iv, v) VDDdrop 100 mV Supply Voltage for NVM programming VDD 3.0 3.6 V Ambient Temperature Range TA -40 85 °C Table 3 Recommended Operating Conditions (iii) Performance for 2.6V < VDD < 2.7V might be degraded. (iv) Operation is not guaranteed below 2.6V. Should VDD briefly drop below this minimum value, then the SX8663 may require; - a hardware reset issued by the host using the RESETB pin - a software reset issued by the host using the I2C interface (v) In the event the host processor is reset or undergoes a power OFF/ON cycle, it is recommended that the host also resets the SX8663 and assures that parameters are re-written into the SPM (should these differ to the parameters held in NVM). 2.3 Thermal Characteristics Parameter Symbol Min. Max. Unit Thermal Resistance - Junction to Ambient (vi) θJA 25 °C/W Table 4 Thermal Characteristics (vi) Static airflow |
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