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12000-A1 Datasheet(PDF) 1 Page - M/A-COM Technology Solutions, Inc. |
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12000-A1 Datasheet(HTML) 1 Page - M/A-COM Technology Solutions, Inc. |
1 / 4 page Electrical Characterization of Packages for Use with GaAs MMIC Amplifiers Rev. V4 Application Note M542 • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.4155721 • China Tel: +86.21.2407.1588 1 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Abstract A test methodology will be presented which combines the advantage of on-wafer RF probing with a TRL calibration to create a completely de-embeddable, novel “test fixture” capable of electrically characteriz- ing most any style package or device. This scheme has been used to characterize many of the currently available microwave packages in order to identify ap- propriate packages for our MMIC amplifier products which cover frequencies up to 12 GHz. In addition, the technique has been employed to characterize in- jection-molded plastic packages and to evaluate non- probeable MMIC's. Introduction Most package vendors have very little microwave design and characterization capability. Their lim- ited characterization efforts typically involve the use of poor fixturing, which obscures the true frequency response of the package. Companies specializing in fixturing, while investing considerable mechani- cal engineering effort, expend far less on electrical considerations, often producing fixtures inadequate for use at microwave frequencies. Consequently, there is very little microwave performance data available from package vendors. Therefore, to evaluate and identify candidate pack- ages for each of the amplifiers in our MMIC ampli- fier product line, specific fixturing had to be devel- oped for each package style considered. A novel fixturing approach was designed and implemented, which not only eliminates the need for expensive, package specific fixtures, but also overcomes the frequency limitations of traditional connectorized, plunger-style fixtures. Additionally, a rigorous cali- bration method was developed which allows com- plete fixture de-embedding. This test methodology is applicable to practically any style device. Table 1 lists the package styles investigated. Through this work, proper electrical characterization of commonly used packages has indicated useful frequency ranges broader than expected by even the package manufacturers. This finding has allowed us to use low-cost pack- ages for frequency applications where our competi- tors typically resort to high-priced custom pack- ages. Package Description Manufacturer 5 lead, ceramic Kyocera 6 lead, ceramic Kyocera Leadless, 6 port, ceramic StratEdge 7 lead, ceramic Kyocera 8 lead, ceramic Kyocera 8 lead, glass Mini-Systems 8 lead, glass, ground straps Mini-Systems Leadless, 8 port, ceramic Oxley Leadless, 10 port, ceramic Alcoa Table 1. Summary of Packages Design Approach To eliminate the need for expensive, device spe- cific, traditional fixtures and overcome their fre- quency limitations, an RF probeable ceramic sub- strate was designed as the interface to the device- under-test (DUT). Figure 1 illustrates this coplanar probe to microstrip transition. It is a 50 ohm line fabricated on 10-mil thick alumina, with an 8-mil pitch, ground-signal-ground (G-S-G) probe pattern at one end. The two ground pads are connected to the substrate backside with 8-mil diameter plated vias. The G-S-G pattern can be probed using com- mercially available microwave probes on a stan- dard microwave probe station. The opposite end of the substrate can be bonded to a test port of the DUT. To complete the “test fixture,” only a thin brass block is required to serve as the mounting surface for the ceramic substrates and the DUT. If neces- sary, the brass block could be machined to com- pensate for any difference in height between the substrate and DUT test port. To fixture practically any DUT, all that is needed is a brass plate and the probeable ceramic substrates. Figure 2 shows the configuration used for characterizing our MAAM71200-H1, a packaged 7-12 GHz GaAs MMIC low noise amplifier. |
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