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M567 Datasheet(PDF) 2 Page - M/A-COM Technology Solutions, Inc. |
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M567 Datasheet(HTML) 2 Page - M/A-COM Technology Solutions, Inc. |
2 / 2 page CR-15 Package Handling and Mounting Procedure Rev. V5 Application Note M567 2 ADVANCED: Data Sheets contain information regarding a product M/A-COM Technology Solutions is considering for development. Performance is based on target specifications, simulated results, and/or prototype measurements. Commitment to develop is not guaranteed. PRELIMINARY: Data Sheets contain information regarding a product M/A-COM Technology Solutions has under development. Performance is based on engineering tests. Specifications are typical. Mechanical outline has been fixed. Engineering samples and/or test data may be available. Commitment to produce in volume is not guaranteed. • North America Tel: 800.366.2266 • Europe Tel: +353.21.244.6400 • India Tel: +91.80.43537383 • China Tel: +86.21.2407.1588 Visit www.macomtech.com for additional data sheets and product information. M/A-COM Technology Solutions Inc. and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice. Mounting Hardware / Torque Sequence Size #2 socket head cap screws and medium split lock washers are recommended. The mounting hardware should initially be installed finger tight (approximately 4 inch-ounces), followed by a controlled torque of 48 inch- ounces , in an alternating torque sequence. The use of two separate calibrated torque screw drives is recommended for this purpose, especially in high volume applications. Manual drive is acceptable, but electric or pneumatic drive torque tools are preferred to minimize operator fatigue. Incorrect installation torque may cause inconsistent electrical and thermal performance and lead to device failure. Package Lead Soldering Recommendations A 63/37 tin/lead eutectic is the preferred solder for pre- tinning and attaching the package lead to the surrounding circuit board. Since the typical thickness of gold plating on the package leads is 50 micro-inches minimum, pre-tinning of the package leads may be necessary to reduce gold embrittlement in the solder joint. Pre-tinning will result in the highest reliability connection, especially when solder volumes are relatively low. The necessity to pre-tin will depend on the particular application and the soldering equipment being used. For applications where surface mount components are to be installed after the CR-15 installation, this package will not be damaged when subjected to typical convection or IR over reflow profiles. M/A-COM Tech Application Note M538 may be used as a guide for maximum allowable reflow time and temperature. Alternatively, the package leads may be individually soldered. Whether an iron or hot gas soldering equipment is used, care should be take to insure that the temperature is well controlled and the assembly environment is electric static discharge (ESD) safe. |
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