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BSP320S Datasheet(PDF) 2 Page - Siemens Semiconductor Group |
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BSP320S Datasheet(HTML) 2 Page - Siemens Semiconductor Group |
2 / 8 page Semiconductor Group 2 29/01/1998 BSP 320 S Maximum Ratings Parameter Symbol Values Unit Chip or operating temperature Tj -55 ... + 150 °C Storage temperature Tstg -55 ... + 150 Thermal resistance, chip to ambient air 1) RthJA ≤ 70 K/W Thermal resistance, junction-soldering point 1) RthJS 17 IEC climatic category, DIN IEC 68-1 55 / 150 / 56 1) Transistor on epoxy pcb 40 mm x 40 mm x 1,5 mm with 6 cm2 copper area for drain connection *) MIL STD 883, Method 3015, Class 2 Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain- source breakdown voltage VGS = 0 V, ID = 0.25 mA, Tj = 25 °C V(BR)DSS 60 - - V Gate threshold voltage VGS=VDS, ID = 20 µA VGS(th) 2.1 3 4 Zero gate voltage drain current VDS = 60 V, VGS = 0 V, Tj = -40 °C VDS = 60 V, VGS = 0 V, Tj = 25 °C VDS = 60 V, VGS = 0 V, Tj = 125 °C IDSS - - - - 0.1 - 100 1 0.1 µA Gate-source leakage current VGS = 20 V, VDS = 0 V IGSS - 10 100 nA Drain-Source on-state resistance VGS = 10 V, ID = 2.9 A RDS(on) - 0.09 0.12 Ω |
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