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ESTW025A0F41-HZ Datasheet(PDF) 10 Page - Lineage Power Corporation |
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ESTW025A0F41-HZ Datasheet(HTML) 10 Page - Lineage Power Corporation |
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10 / 20 page  Data Sheet October 11, 2011 ESTW025A0F Series Eighth-Brick Power Modules 36–75Vdc Input; 3.3Vdc Output; 25A Output LINEAGE POWER 10 Surface Mount Information Pick and Place The ESTW025A0F modules use an open frame construction and are designed for a fully automated assembly process. The modules are fitted with a label designed to provide a large surface area for pick and place operations. The label meets all the requirements for surface mount processing, as well as safety standards, and is able to withstand reflow temperatures of up to 300 oC. The label also carries product information such as product code, serial number and the location of manufacture. Figure 18. Pick and Place Location. Nozzle Recommendations The module weight has been kept to a minimum by using open frame construction. Even so, these modules have a relatively large mass when compared to conventional SMT components. Variables such as nozzle size, tip style, vacuum pressure and placement speed should be considered to optimize this process. The minimum recommended nozzle diameter for reliable operation is 6mm. The maximum nozzle outer diameter, which will safely fit within the allowable component spacing, is 9 mm. Oblong or oval nozzles up to 11 x 9 mm may also be used within the space available. Tin Lead Soldering The ESTW025A0F power modules are lead free modules and can be soldered either in a lead-free solder process or in a conventional Tin/Lead (Sn/Pb) process. It is recommended that the customer review data sheets in order to customize the solder reflow profile for each application board assembly. The following instructions must be observed when soldering these units. Failure to observe these instructions may result in the failure of or cause damage to the modules, and can adversely affect long-term reliability. In a conventional Tin/Lead (Sn/Pb) solder process peak reflow temperatures are limited to less than 235 oC. Typically, the eutectic solder melts at 183oC, wets the land, and subsequently wicks the device connection. Sufficient time must be allowed to fuse the plating on the connection to ensure a reliable solder joint. There are several types of SMT reflow technologies currently used in the industry. These surface mount power modules can be reliably soldered using natural forced convection, IR (radiant infrared), or a combination of convection/IR. For reliable soldering the solder reflow profile should be established by accurately measuring the modules CP connector temperatures. REFLOW TIME (S) Figure 19. Reflow Profile for Tin/Lead (Sn/Pb) process. Figure 20. Time Limit Curve Above 205 oC for Tin/Lead (Sn/Pb) process Lead Free Soldering The –Z version of the ESTW025A0F modules are lead-free (Pb-free) and RoHS compliant and are both forward and backward compatible in a Pb-free and a SnPb soldering process. Failure to observe the instructions below may result in the failure of or cause damage to the modules and can adversely affect long-term reliability. Reflow Soldering Information The surface mountable modules in the ESTW025A0F-S family use our newest SMT 0 50 100 150 200 250 300 P reheat zone max 4oCs-1 Soak zone 30-240s Heat zone max 4oCs-1 P eak Temp 235oC Cooling zone 1-4oCs-1 T lim above 205oC 200 205 210 215 220 225 230 235 240 0 10 203040 5060 |
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