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PSMN2R6-30YLC Datasheet(PDF) 3 Page - NXP Semiconductors |
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PSMN2R6-30YLC Datasheet(HTML) 3 Page - NXP Semiconductors |
3 / 15 page PSMN2R6-30YLC All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved. Product data sheet Rev. 01 — 2 May 2011 3 of 15 NXP Semiconductors PSMN2R6-30YLC N-channel 30 V 2.8m Ω logic level MOSFET in LFPAK using NextPower 5. Limiting values [1] Continuous current is limited by package. Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VDS drain-source voltage 25 °C ≤ Tj ≤ 175 °C - 30 V VDGR drain-gate voltage 25 °C ≤ Tj ≤ 175 °C; RGS =20kΩ -30 V VGS gate-source voltage -20 20 V ID drain current VGS =10V; Tmb = 25 °C; see Figure 1 [1] - 100 A VGS =10V; Tmb = 100 °C; see Figure 1 [1] - 100 A IDM peak drain current pulsed; tp ≤ 10 µs; Tmb =25°C; see Figure 4 - 575 A Ptot total power dissipation Tmb = 25 °C; see Figure 2 - 106 W Tstg storage temperature -55 175 °C Tj junction temperature -55 175 °C Tsld(M) peak soldering temperature - 260 °C VESD electrostatic discharge voltage MM (JEDEC JESD22-A115) 460 - V Source-drain diode IS source current Tmb =25°C - 96 A ISM peak source current pulsed; tp ≤ 10 µs; Tmb = 25 °C - 575 A Avalanche ruggedness EDS(AL)S non-repetitive drain-source avalanche energy VGS =10V; Tj(init) =25 °C; ID = 100 A; Vsup ≤ 30 V; RGS =50 Ω; unclamped; see Figure 3 -50 mJ Fig 1. Continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature 003a a f659 0 30 60 90 120 150 0 50 100 150 200 Tmb ( °C) ID (A) (1) Tmb (°C) 0 200 150 50 100 03na19 40 80 120 Pder (%) 0 |
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