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WINBOND |
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W29GL032C 56 D E A B 0.07 (2X) TOP VIEW PIN A1 CORNER 0.07 C (2X) eE SD PIN A1 CORNER Øb BOTTOM VIEW SE E1 eD D1 H G F E D C B A 8 7 6 5 4 3 2 1 0.15 C 0.15 C 0.25 C // A A2 A1 C SIDE VIEW 64X Øb Ø 0.20 Ø 0.10 M M M M C C B A 9.3 Low-Profile Fine-Pitch Ball Grid Array, 64-ball 11x13mm (LFBGA64) SYMBOL DIMENSION (MM) NOTE MIN NOM MAX A - - 1.40 PROFILE A1 0.40 - BALL HEIGHT A2 0.60 - BODY THICKNESS D 13.00 BSC BODY SIZE E 11.00 BSC BODY SIZE D1 7.00 BSC MATRIX FOOTPRINT E1 7.00 BSC MATRIX FOOTPRINT n 64 BALL COUNT Øb 0.5 0.6 0.7 BALL DIAMETER eE 1.00 BSC BALL PITCH eD 1.00 BSC BALL PITCH SD/SE 0.50 BSC SOLDER BALL PLACEMENT NONE DEPOPULATED SOLDER BALLS Figure 9-3 LFBGA 64-ball 11x13mm |