W25X64

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Table of Contents

1

GENERAL DESCRIPTION................................................................................................... 4

2

FEATURES........................................................................................................................ 4

3

PIN CONFIGURATION WSON 8X6-MM ................................................................................ 5

4

PIN CONFIGURATION PDIP 300-MIL ................................................................................... 5

5

PIN DESCRIPTION PDIP 300-MIL, WSON 8X6...................................................................... 6

6

PIN CONFIGURATION SOIC 300-MIL ................................................................................... 6

7

PIN DESCRIPTION SOIC 300-MIL........................................................................................ 7

7.1

Package Types ....................................................................................................... 8

7.2

Chip Select (/CS) .................................................................................................... 8

7.3

Serial Data Output (DO)........................................................................................... 8

7.4

Write Protect (/WP)................................................................................................. 8

7.5

HOLD (/HOLD)........................................................................................................ 8

7.6

Serial Clock (CLK)................................................................................................... 8

7.7

Serial Data Input / Output (DIO) ................................................................................ 8

8

BLOCK DIAGRAM.............................................................................................................. 9

9

FUNCTIONAL DESCRIPTION .............................................................................................10

9.1

SPI OPERATIONS .................................................................................................10

9.1.1

SPI Modes ....................................................................................................................................10

9.1.2

Dual Output SPI...........................................................................................................................10

9.1.3

Hold Function ..............................................................................................................................10

9.2

WRITE PROTECTION.............................................................................................11

9.2.1

Write Protect Features ...............................................................................................................11

10

CONTROL AND STATUS REGISTERS ................................................................................12

10.1

STATUS REGISTER...............................................................................................12

10.1.1

BUSY...........................................................................................................................................12

10.1.2

Write Enable Latch (WEL).......................................................................................................12

10.1.3

Block Protect Bits (BP2, BP1, BP0) .......................................................................................12

10.1.4

Top/Bottom Block Protect (TB) ...............................................................................................12

10.1.5

Reserved Bits ............................................................................................................................12

10.1.6

Status Register Protect (SRP)................................................................................................13

10.1.7

Status Register Memory Protection.......................................................................................13

10.2

INSTRUCTIONS .....................................................................................................14

10.2.1

Manufacturer and Device Identification.................................................................................14

10.2.2

Instruction Set............................................................................................................................15