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VSMF9700-GS08 Datasheet(PDF) 4 Page - Vishay Siliconix |
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VSMF9700-GS08 Datasheet(HTML) 4 Page - Vishay Siliconix |
4 / 6 page www.vishay.com For technical questions, contact: emittertechsupport@vishay.com Document Number: 81475 4 Rev. 1.5, 03-Nov-09 VSMF9700X01 Vishay Semiconductors High Speed Infrared Emitting Diode, 890 nm Fig. 9 - Relative Spectral Sensitivity vs. Wavelength Fig. 10 - Relative Radiant Intensity vs. Angular Displacement PACKAGE DIMENSIONS in millimeters REFLOW SOLDER PROFILE Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020 DRYPACK Devices are packed in moisture barrier bags (MBB) to prevent the products from moisture absorption during transportation and storage. Each bag contains a desiccant. FLOOR LIFE Floor life (time between soldering and removing from MBB) must not exceed the time indicated on MBB label: Floor life: 168 h Conditions: Tamb < 30 °C, RH < 60 % Moisture sensitivity level 3, acc. to J-STD-020. DRYING In case of moisture absorption devices should be baked before soldering. Conditions see J-STD-020 or label. Devices taped on reel dry using recommended conditions 192 h at 40 °C (+ 5 °C), RH < 5 %. λ - Wavelength (nm) 20420 0 0.25 0.5 0.75 1 1.25 800 820 840 860 880 900 920 940 960 980 1000 0.4 0.2 0 94 8013 0.6 0.9 0.8 0° 30° 10° 20° 40° 50° 60° 70° 80° 0.7 1.0 Mounting Pad Layout 1.2 1.6 (1.9) 4 area covered with solder resist Drawing-No.: 6.541-5067.02-4 Issue: 2; 30.07.07 20767 technical drawings according to DIN specifications Pin identification 3.5 ± 0.2 3 + 0.15 Ø 2.4 AC 0 50 100 150 200 250 300 0 50 100 150 200 250 300 Time (s) 240 °C 245 °C max. 260 °C max. 120 s max. 100 s 217 °C max. 30 s max. ramp up 3 °C/s max. ramp down 6 °C/s 19841 255 °C |
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