www.vishay.com

Document Number: 81475

4

Rev. 1.5, 03-Nov-09

VSMF9700X01

890 nm

Fig. 9 - Relative Spectral Sensitivity vs. Wavelength

Fig. 10 - Relative Radiant Intensity vs. Angular Displacement

PACKAGE DIMENSIONS in millimeters

REFLOW SOLDER PROFILE

Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020

DRYPACK

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a desiccant.

FLOOR LIFE

Floor life (time between soldering and removing from MBB)

must not exceed the time indicated on MBB label:

Floor life: 168 h

Moisture sensitivity level 3, acc. to J-STD-020.

DRYING

In case of moisture absorption devices should be baked

before soldering. Conditions see J-STD-020 or label.

Devices taped on reel dry using recommended conditions

192 h at 40 °C (+ 5 °C), RH < 5 %.

λ - Wavelength (nm)

20420

0

0.25

0.5

0.75

1

1.25

800 820 840 860 880 900 920 940 960 980 1000

0.4

0.2

0

94 8013

0.6

0.9

0.8

0°

30°

10°

20°

40°

50°

60°

70°

80°

0.7

1.0

Mounting Pad Layout

1.2

1.6 (1.9)

4

area covered with

solder resist

Drawing-No.: 6.541-5067.02-4

Issue: 2; 30.07.07

20767

technical drawings

according to DIN

specifications

Pin identification

3.5 ± 0.2

3 + 0.15

Ø 2.4

AC

0

50

100

150

200

250

300

0

50

100

150

200

250

300

Time (s)

240 °C

245 °C

max. 260 °C

max. 120 s

max. 100 s

217 °C

max. 30 s

max. ramp up 3 °C/s max. ramp down 6 °C/s

19841

255 °C