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TFU0603FF04000P100 Datasheet(PDF) 6 Page - Vishay Siliconix

Part # TFU0603FF04000P100
Description  Thick Film Chip Fuses
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Manufacturer  VISHAY [Vishay Siliconix]
Direct Link  http://www.vishay.com
Logo VISHAY - Vishay Siliconix

TFU0603FF04000P100 Datasheet(HTML) 6 Page - Vishay Siliconix

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For technical questions, contact: fuse@vishay.com
Document Number: 28797
6
Revision: 26-May-10
TFU 0603
Vishay Beyschlag
Thick Film Chip Fuses
TESTS AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
UL/CSA 248-14, Low voltage fuses - Part 14: Supplemental
Fuses
IEC 60127-4, Universal Modular Fuse Links (UMF)
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by METI and CCC.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar)
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60127-4, unless otherwise
specified.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of UL 248-14 and IEC 60127-4 respectively.
However,
some
additional
tests
and
a
number
of
improvments against those minimum requirements have
been included.
TEST PROCEDURES AND REQUIREMENTS
UL/CSA
248-14
IEC 60068-2
TEST
METHOD
TEST
PROCEDURE
REQUIREMENTS
PERMISSIBLE CHANGE
-21 (Ue1)
Substrate bending
Depth 3 mm;
rate 1 mm/s
1 time
No visible damage;
ΔR/R ≤ 15 %
-
58 (Td)
Solderability
Solder bath method;
SnPb40;
non-activated flux;
(215 ± 3) °C; (3 ± 0.3) s
Good tinning (
≥ 95 % covered);
no visible damage
Solder bath method;
SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
(235 ± 3) °C; (2 ± 0.2) s
Good tinning (
≥ 95 % covered);
no visible damage
Resistance to
soldering heat
Solder bath method;
(260 ± 5) °C; (10 ± 1) s
No visible damage;
ΔR/R ≤ 15 %
Reflow method 2
(
IR/forced gas convection);
(260 ± 5) °C; (10 ± 1) s
No visible damage;
ΔR/R ≤ 15 %
-
-
Time/current
characteristics at
nominal
temperature
Destructive testing under
overcurrent conditions
(DC-current)
At 2.0 x
IR, tpre-arc < 60 s
At 2.5 x
IR, tpre-arc < 5 s
5.5
-
Interrupting rating
(DC)
35 A at rated voltage
Optical inspection with naked eye;
no visible damage
-
-
Endurance test acc.
to IEC 60127-4,
clause 9.4
a)
I = 1.0 x IR (DC)
1.0 h on; 0.25 h off;
23 °C; 100 times
b)
I = 1.25 x IR (DC)
1.0 h on
23 °C; 1 time
No visible damage;
ΔR/R ≤ 15 %
8.2.3
-
Verification of
temp.-rise and
current-carrying
capacity
I = 1.0 x IR (DC)
Temperature rise of hot spot
≤ 75 K acc. to
UL 248-14, clause 8.2.4
-
-
Time/current
characteristics
at elevated
temperature.
IEC 60127-1,
clause 9.2.2
I = 1.1 x IR (DC) at 70 °C; 1.0 h
No visible damage;
ΔR/R ≤ 15 %


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