Electronic Components Datasheet Search |
|
TFU0603FF04000P100 Datasheet(PDF) 6 Page - Vishay Siliconix |
|
TFU0603FF04000P100 Datasheet(HTML) 6 Page - Vishay Siliconix |
6 / 7 page www.vishay.com For technical questions, contact: fuse@vishay.com Document Number: 28797 6 Revision: 26-May-10 TFU 0603 Vishay Beyschlag Thick Film Chip Fuses TESTS AND REQUIREMENTS All tests are carried out in accordance with the following specifications: UL/CSA 248-14, Low voltage fuses - Part 14: Supplemental Fuses IEC 60127-4, Universal Modular Fuse Links (UMF) For the full test schedule refer to the documents listed above. The testing also covers most of the requirements specified by METI and CCC. The tests are carried out in accordance with IEC 60068 and under standard atmospheric conditions in accordance with IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated temperature range: Lower category temperature, upper category temperature; damp heat, long term, 56 days) is valid. Unless otherwise specified the following values apply: Temperature: 15 °C to 35 °C Relative humidity: 45 % to 75 % Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar) The components are mounted for testing on printed-circuit boards in accordance with IEC 60127-4, unless otherwise specified. The requirements stated in the Test Procedures and Requirements table are based on the required tests and permitted limits of UL 248-14 and IEC 60127-4 respectively. However, some additional tests and a number of improvments against those minimum requirements have been included. TEST PROCEDURES AND REQUIREMENTS UL/CSA 248-14 IEC 60068-2 TEST METHOD TEST PROCEDURE REQUIREMENTS PERMISSIBLE CHANGE -21 (Ue1) Substrate bending Depth 3 mm; rate 1 mm/s 1 time No visible damage; ΔR/R ≤ 15 % - 58 (Td) Solderability Solder bath method; SnPb40; non-activated flux; (215 ± 3) °C; (3 ± 0.3) s Good tinning ( ≥ 95 % covered); no visible damage Solder bath method; SnAg3Cu0.5 or SnAg3.5; non-activated flux; (235 ± 3) °C; (2 ± 0.2) s Good tinning ( ≥ 95 % covered); no visible damage Resistance to soldering heat Solder bath method; (260 ± 5) °C; (10 ± 1) s No visible damage; ΔR/R ≤ 15 % Reflow method 2 ( IR/forced gas convection); (260 ± 5) °C; (10 ± 1) s No visible damage; ΔR/R ≤ 15 % - - Time/current characteristics at nominal temperature Destructive testing under overcurrent conditions (DC-current) At 2.0 x IR, tpre-arc < 60 s At 2.5 x IR, tpre-arc < 5 s 5.5 - Interrupting rating (DC) 35 A at rated voltage Optical inspection with naked eye; no visible damage - - Endurance test acc. to IEC 60127-4, clause 9.4 a) I = 1.0 x IR (DC) 1.0 h on; 0.25 h off; 23 °C; 100 times b) I = 1.25 x IR (DC) 1.0 h on 23 °C; 1 time No visible damage; ΔR/R ≤ 15 % 8.2.3 - Verification of temp.-rise and current-carrying capacity I = 1.0 x IR (DC) Temperature rise of hot spot ≤ 75 K acc. to UL 248-14, clause 8.2.4 - - Time/current characteristics at elevated temperature. IEC 60127-1, clause 9.2.2 I = 1.1 x IR (DC) at 70 °C; 1.0 h No visible damage; ΔR/R ≤ 15 % |
Similar Description - TFU0603FF04000P100 |
|
|
Link URL |
Privacy Policy |
ALLDATASHEET.COM |
Does ALLDATASHEET help your business so far? [ DONATE ] |
About Alldatasheet | Advertisement | Datasheet Upload | Contact us | Privacy Policy | Link Exchange | Manufacturer List All Rights Reserved©Alldatasheet.com |
Russian : Alldatasheetru.com | Korean : Alldatasheet.co.kr | Spanish : Alldatasheet.es | French : Alldatasheet.fr | Italian : Alldatasheetit.com Portuguese : Alldatasheetpt.com | Polish : Alldatasheet.pl | Vietnamese : Alldatasheet.vn Indian : Alldatasheet.in | Mexican : Alldatasheet.com.mx | British : Alldatasheet.co.uk | New Zealand : Alldatasheet.co.nz |
Family Site : ic2ic.com |
icmetro.com |