TPS92070

www.ti.com

SLUSAN1

– DRAFT 6 * AUGUST 30, 2011

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

TEMPERATURE

TRANSPORT

ORDERABLE

PACKAGE

PINS

UNITS

MATERIAL

NUMBER

Tube

70

TPS92070PW

–40°C to 140°C

Plastic TSSOP

16

Tape and Reel

2000

TPS92070PWR

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

(2)

Package drawings, thermal data, and symbolization are available at www.ti.com/packaging

ABSOLUTE MAXIMUM RATINGS

(1) (2) (3)

All voltages are with respect to GND,

terminal (unless otherwise noted)

VALUE

UNITS

MIN

MAX

Supply voltage

–0.3

25.0

ISO, CS, COMP, LP, MIN, SEN, PCS

–0.3

7.0

BP, GATE, TDD

–0.3

7.2

Input voltages

VD

–1.4

7.0

–0.3

20.0

VZ (pulse

< 1 ms)

5

BP

–0.5

0

Input current

Peak

30

mA

DTC

Average

16

VDD

5

–40

140

°C

–65

150

°C

Lead temperature (10 seconds)

260

°C

(1)

These are stress ratings only. Stress beyond these limits may cause permanent damage to the device. Functional operation of the

device at these or any conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to

absolute maximum rated conditions for extended periods of time may affect device reliability

(2)

All voltages are with respect to GND.

(3)

All currents are positive into the terminal, negative out of the terminal.

(4)

VDD clamped at approximately 23 V. See ELECTRICAL CHARACTERISTICS table.

(5)

VZ clamped at approximately 12.5 V. See ELECTRICAL CHARACTERISTICS table.

(6)

Higher temperature may be applied during board soldering process according to the current JEDEC J-STD-020 specification with peak

reflow temperatures not higher than classified on the device label on the shipping boxes or reels.

Copyright

© 2011, Texas Instruments Incorporated

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