ISL8023, ISL8024

3

FN7812.0

December 22, 2011

Typical ApplicationBlock Diagram

Ordering Information

PART NUMBER

(Notes 1, 2)

PART

MARKING

OUTPUT VOLTAGE

(V)

TEMP. RANGE

(°C)

PACKAGE

(Pb-Free)

PKG.

DWG. #

ISL8023IRTAJZ

023A

ADJUSTABLE

-40 to +85

16 Ld 3x3 TQFN

L16.3x3D

ISL8024IRTAJZ

024A

ADJUSTABLE

-40 to +85

16 Ld 3x3 TQFN

L16.3x3D

ISL8023AIRTAJZ

23AA

ADJUSTABLE

-40 to +85

16 Ld 3x3 TQFN

L16.3x3D

ISL8024AIRTAJZ

24AA

ADJUSTABLE

-40 to +85

16 Ld 3x3 TQFN

L16.3x3D

NOTES:

1. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.

2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte

tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil

Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

3. For Moisture Sensitivity Level (MSL), please see device information page for ISL8023, ISL8024. For more information on MSL please see techbrief

TB363.

L

1µH

PHASE

PGND

VFB

VIN

EN

PG

SS

INPUT

2.7V TO 5.5V

OUTPUT

1.8V/4A

C1

22µF

ISL8023, ISL8024

C2

R2

200k

R3

100k

2 x 22µF

SGND

C3*

4.7pF

R1

100k

FIGURE 2. TYPICAL APPLICATION DIAGRAM

COMP

SYNC

FS

VIN

* C3 is optional. Recommend to

put a placeholder for it. Check

loop analysis first before use.

VDD

SGND

TABLE 1. COMPONENT SELECTION TABLE

0.8V

1.2V

1.5V

1.8V

2.5V

3.3V

3.6

C1

22µF

22µF

22µF

22µF

22µF

22µF

22µF

C2

4X22µF

2 x 22µF

2 x 22µF

2 x 22µF

2 x 22µF

2 x 22µF

2 x 22µF

C3

4.7pF

4.7pF

4.7pF

4.7pF

4.7pF

4.7pF

4.7pF

L1

0.47~1µH

0.47~1µH

0.47~1µH

0.68~1.5µH

0.68~1.5µH

1~2.2µH

1~2.2µH

R2

33k

100k

150k

200k

316k

450k

500k

R3

100k

100k

100k

100k

100k

100k

100k