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ISO3080 Datasheet(PDF) 10 Page - Texas Instruments |
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ISO3080 Datasheet(HTML) 10 Page - Texas Instruments |
10 / 20 page ISO3080, ISO3086 ISO3082, ISO3088 SLOS581D – MAY 2008 – REVISED JANUARY 2011 www.ti.com IEC 60664-1 RATINGS TABLE PARAMETER TEST CONDITIONS SPECIFICATION Basic isolation group Material group IIIa Rated mains voltage ≤ 150 VRMS I-IV Installation classification Rated mains voltage ≤ 300 VRMS I-III Rated mains voltage ≤ 400 VRMS I-II IEC 60747-5-2 INSULATION CHARACTERISTICS (1) over recommended operating conditions (unless otherwise noted) PARAMETER TEST CONDITIONS SPECIFICATION UNIT Maximum working insulation VIORM 560 V voltage Method b1, VPR = VIORM × 1.875, VPR Input to output test voltage 1050 V 100% Production test with t = 1 s, Partial discharge < 5 pC VIOTM Transient overvoltage t = 60 s 4000 V RS Insulation resistance VIO = 500 V at TS >109 Ω Pollution degree 2 (1) Climatic Classification 40/125/21 REGULATORY INFORMATION VDE CSA UL Approved under CSA Component Recognized under 1577 Component Certified according to IEC 60747-5-2 Acceptance Notice Recognition Program(1) File Number: 40016131 File Number: 220991 File Number: E181974 (1) Production tested ≥3000 VRMS for 1 second in accordance with UL 1577. IEC SAFETY LIMITING VALUES Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry. A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system failures. PARAMETER MIN TYP MAX UNIT Safety input, output, or supply qJA = 168°C/W, VI = 5.5 V, TJ = 170°C, IS DW-16 157 mA current TA = 25°C TS Maximum case temperature DW-16 150 °C The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the Thermal Characteristics table is that of a device installed in the JESD51-3, Low Effective Thermal Conductivity Test Board for Leaded Surface Mount Packages and is conservative. The power is the recommended maximum input voltage times the current. The junction temperature is then the ambient temperature plus the power times the junction-to-air thermal resistance. 10 Submit Documentation Feedback Copyright © 2008–2011, Texas Instruments Incorporated Product Folder Link(s): ISO3080, ISO3086 ISO3082, ISO3088 |
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