HI-8592, HI-8593, HI-8594

HOLT INTEGRATED CIRCUITS

7

0V

10V

-10V

5V

0V

5V

0V

10%

90%

t

fx

10%

90%

t

phlx

10%

TX1IN

TX0IN

V

DIFF

(TXAOUT - TXBOUT)

t

fx

t

rx

t

rx

t

plhx

t

phlx

t

plhx

Figure 3. Line Driver Timing

PACKAGE THERMAL CHARACTERISTICS

Maximum ARINC LOAD

ARINC 429

Data Rate

Junction Temp, T

T

T

T

T

T

14-Lead Plastic

30

31

32

33

93

134

36

36

37

35

95

135

ARINC 429

Data Rate

Junction Temp, T

T

T

T

T

T

14-Lead Plastic

89

82

77

53

111

149

87

81

77

52

111

149

Notes:

1.

All data taken in still air.

2.

At 100% duty cycle, 5V power supplies.

3.

Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms, C = 30 nF.

4.

High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms, C = 10 nF. Data not presented for C = 30 nF as this is considered unrealistic for

high speed operation.

5.

14 Lead Plastic ESOIC (Thermally enhanced SOIC with built in heat sink). Heat sink not soldered.

6.

Similar results would be obtained with TXAOUT shorted to TXBOUT.

7.

For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

8.

Data will vary depending on air flow and the method of heat sinking employed.