ORDERING INFORMATION

Notes:

1. All data taken

on devices soldered to a single layer copper PCB (3" X 4.5" X .062").

2. At 100% duty cycle, 15V power supplies. For 12V power supplies multiply all tabulated values by 0.8.

3. Low Speed: Data Rate = 12.5 Kbps, Load: R = 400 Ohms,C=30nF.

4. High Speed: Data Rate = 100 Kbps, Load: R = 400 Ohms,C=10nF. Data not presented forC=30nF

as this is considered unrealistic for high speed operation.

5. Similar results would be obtained with AOUT shorted to BOUT.

6. For applications requiring survival with continuous short circuit, operation above Tj = 175°C is not recommended.

7. Data will vary depending on air flow and the method of heat sinking employed.

in still air

HI-8382 PACKAGE THERMAL CHARACTERISTICS

(1) Process Flows M and DSCC always have Tin/Lead (Sn/Pb) solder lead finish.

(2) DSCC SMD# 5962-8687901EA. Only available in “C” package with Sn/Pb solder lead finish.

(3) Gold terminal finish is Pb-Free, RoHS compliant.

HI -

(Ceramic)

838xxx-xx

37.5 Ohms

Yes

13 Ohms

No

PART

NUMBER

8382

8383

OUTPUT SERIES

RESISTANCE

FUSE

A

and B

Shorted To Ground

OUT

OUT

5, 6, 7

1

2

PACKAGE S TYLE

ARINC 429

SUPPLY CURRENT (mA)

JUNCTION TEMP, T j ( °C)

DATA RATE

16 Lead Ceramic S B D IP

Ta = 25°C

Ta = 85°C

Ta = 125°C

Ta = 25°C

Ta = 85°C

Ta = 125°C

Low Speed

60.1

55.7

52.4

110

157

194

High Speed

63.1

56.3

52.3

100

150

182

Low Speed

62.1

56.2

53.0

9 0

145

180

High Speed

64.0

56.2

52.2

8 6

144

176

3

4

28 Lead PLCC

MAXIMUM ARINC LOAD

7

1

2

PACKAGE S TYLE

ARINC 429

SUPPLY CURRENT (mA)

JUNCTION TEMP, T j ( °C)

DATA RATE

16 Lead Ceramic S B D IP

Ta = 25°C

Ta = 85°C

Ta = 125°C

Ta = 25°C

Ta = 85°C

Ta = 125°C

Low Speed

17.6

17.2

17.0

4 8

107

142

High Speed

25.4

24.5

24.2

5 6

110

150

Low Speed

17.9

17.4

17.1

4 1

103

145

High Speed

25.8

24.8

24.4

4 7

112

147

3

4

28 Lead PLCC

HI-8382, HI-8383

TEMPERATURE

RANGE

BURN

IN

-40°C to +85°C

No

-55°C to +125°C

-55°C to +125°C

-55°C to +125°C

No

Yes

Yes

T

M

DSCC

PART

NUMBER

T

M-01

M-03

Blank

FLOW

I

NOTES

(1)

(1) & (2)

PACKAGE

DESCRIPTION

16 PIN CERAMIC SIDE BRAZED DIP (16C)

Gold

PART

NUMBER

C

28 PIN CERAMIC LEADLESS CHIP CARRIER (28S)

Gold

32 PIN CERQUAD (32U) not available with ‘M’ flow

Tin/Lead Solder

S

U

LEAD

FINISH

NOTES

(3) & (1)

(3) & (1)

HOLT INTEGRATED CIRCUITS

5