Document Number: 95419

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Revision: 04-Oct-10

1

TO-262

Outline Dimensions

Vishay Semiconductors

DIMENSIONS in millimeters and inches

Notes

not exceed 0.127 mm (0.005") per side. These dimensions are

measured at the outmost extremes of the plastic body

(minimum) and D1 (minimum) where dimensions derived the

actual package outline

SYMBOL

MILLIMETERS

INCHES

NOTES

MIN.

MAX.

MIN.

MAX.

A

4.06

4.83

0.160

0.190

A1

2.03

3.02

0.080

0.119

b

0.51

0.99

0.020

0.039

b1

0.51

0.89

0.020

0.035

4

b2

1.14

1.78

0.045

0.070

b3

1.14

1.73

0.045

0.068

4

c

0.38

0.74

0.015

0.029

c1

0.38

0.58

0.015

0.023

4

c2

1.14

1.65

0.045

0.065

D

8.51

9.65

0.335

0.380

2

D1

6.86

8.00

0.270

0.315

3

E

9.65

10.67

0.380

0.420

2, 3

E1

7.90

8.80

0.311

0.346

3

e

2.54 BSC

0.100 BSC

L

13.46

14.10

0.530

0.555

L1

-

1.65

-

0.065

3

L2

3.56

3.71

0.140

0.146

(4)

(4)

Base

metal

Plating

b1, b3

(b, b2)

c1

c

Section B - B and C - C

Scale: None

Section A - A

(3)

E1

(3)

D1

E

B

A

A

A

c2

c

A1

Seating

plane

Lead tip

(3)

(2) (3)

(2)

A

E

(Datum A)

L1

L2

B

B

C

C

3

2

1

L

D

2 x e

3 x b2

3 x b

0.010

A

B

MM

Modified JEDEC outline TO-262

Lead assignments

Diodes

1. - Anode (two die)/open (one die)

2., 4. - Cathode

3. - Anode