HI-1565CDI / T / M

HI-1566CDI / T / M

HI-1565PCI / T

HI-1566PCI / T

Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.

62°C

122°C

PACKAGE STYLE

CONDITION

54°C/W

JUNCTION TEMPERATURE

162°C

HI-1565PSI / T / M

HI-1566PSI / T / M

Heat sink

unsoldered

Heat sink

soldered

157°C

117°C

57°C

PART NUMBER

129°C

169°C

47°C/W

44-pin Plastic chip-

scale package

Heat sink

unsoldered

49°C/W

59°C

119°C

159°C

20-pin Thermally

enhanced plastic

SOIC (ESOIC)

20-pin Ceramic

side-brazed DIP

Socketed

62°C/W

69°C

HI-1565, HI-1566

THERMAL CHARACTERISTICS

TXA/B

TXA/B

TXINHA/B

TRANSMITTER

BUSA/B

BUSA/B

52.5

(.75 Zo)

W

52.5

(.75 Zo)

W

1.79:1

1:1.79

1:1.4

1.4:1

35

(.5 Zo)

W

Figure 3. Transformer Coupled Test Circuits

Coupling

Transformer

Coupling

Transformer

Isolation

Transformer

Isolation

Transformer

RECEIVER

52.5

(.75 Zo)

W

52.5

(.75 Zo)

W

35

(.5 Zo)

W

RXA/B

RXA/B

RXENA/B

Point

“A ”

T

Point

“A ”

T

Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a

20-pin thermally enhanced SOIC package. The

HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale

package. These packages include a metal heat sink

located on the bottom surface of the device. This heat

sink should be soldered down to the printed circuit board

for optimum thermal dissipation.

The heat sink is

electrically isolated and may be soldered to any

convenient power or ground plane..

HEAT SINK - ESOIC & CHIP-SCALE PACKAGE

HOLT INTEGRATED CIRCUITS

6

APPLICATIONS NOTE

Holt Applications Note AN-500 provides circuit design

notes regarding the use of Holt's family of MIL-STD-1553

transceivers. Layout considerations, as well as

recommended interface and protection components are

included.