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30CTH02-1PBF Datasheet(PDF) 8 Page - Vishay Siliconix |
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30CTH02-1PBF Datasheet(HTML) 8 Page - Vishay Siliconix |
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8 / 9 page  www.vishay.com For technical questions concerning discrete products, contact: diodes-tech@vishay.com Document Number: 95014 2 For technical questions concerning module products, contact: ind-modules@vishay.com Revision: 31-Mar-09 Outline Dimensions Vishay High Power Products D2PAK, TO-262 DIMENSIONS FOR TO-262 in millimeters and inches Notes (1) Dimensioning and tolerancing as per ASME Y14.5M-1994 (2) Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at the outmost extremes of the plastic body (3) Thermal pad contour optional within dimension E, L1, D1 and E1 (4) Dimension b1 and c1 apply to base metal only (5) Controlling dimension: inches (6) Outline conform to JEDEC TO-262 except A1 (maximum), b (minimum) and D1 (minimum) where dimensions derived the actual package outline SYMBOL MILLIMETERS INCHES NOTES MIN. MAX. MIN. MAX. A 4.06 4.83 0.160 0.190 A1 2.03 3.02 0.080 0.119 b 0.51 0.99 0.020 0.039 b1 0.51 0.89 0.020 0.035 4 b2 1.14 1.78 0.045 0.070 b3 1.14 1.73 0.045 0.068 4 c 0.38 0.74 0.015 0.029 c1 0.38 0.58 0.015 0.023 4 c2 1.14 1.65 0.045 0.065 D 8.51 9.65 0.335 0.380 2 D1 6.86 8.00 0.270 0.315 3 E 9.65 10.67 0.380 0.420 2, 3 E1 7.90 8.80 0.311 0.346 3 e 2.54 BSC 0.100 BSC L 13.46 14.10 0.530 0.555 L1 - 1.65 - 0.065 3 L2 3.56 3.71 0.140 0.146 (4) (4) Base metal Plating b1, b3 (b, b2) c1 c Section B - B and C - C Scale: None Section A - A (3) E1 (3) D1 E B A A A c2 c A1 Seating plane Lead tip (3) (2) (3) (2) A E (Datum A) L1 L2 B B C C 3 2 1 L D 2 x e 3 x b2 3 x b 0.010 A B MM Modified JEDEC outline TO-262 Lead assignments Diodes 1. - Anode (two die)/open (one die) 2., 4. - Cathode 3. - Anode |
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