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SM802109UMG Datasheet(PDF) 4 Page - Micrel Semiconductor |
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SM802109UMG Datasheet(HTML) 4 Page - Micrel Semiconductor |
4 / 11 page Micrel, Inc. SM802109 September 2011 4 M9999-092911-B hbwhelp@micrel.com or (408) 955-1690 ..... o V ......... Case Temperature ..................................................... 1 Storage Temperature (Ts) ......................... −65°C to +150°C tage (VDD, VDDO1/2)............... +2.375V to +3.465V –40°C to +85°C Still-Air......................................................... 50°C/W QFN ( ψJB) Junction-to-Board ....................................... 30°C/W acteri (4) O ±5 ±5% or 2.5V ±5% = −40°C rameter ion Min. Typ. Max. Units Absolute Maximum Ratings (1) Supply Voltage (VDD, VDDO1/2)............................ .....+4.6V Supply Vol Input Voltage (V ) .............................. −0.50V t IN Lead Temperature (soldering, 20s)................... DD + 0.5V 260°C 15°C QFN ( θJA) Operating Ratings (2) Ambient Temperature (TA).......................... Junction Thermal Resistance (3) DC Electrical Char stics VDD = VDD 1/2 = 3.3V ±5% or 2.5V % VDD = 3.3V ±5%, VDDO1/2 = 3.3V TA to +85°C. Symbol Pa Condit VDD, VDDO1 o .37 2.5 2.625 V /2 2.5V Operating V ltage 2 5 VDD, VDDO1/2 3.3V Operating Voltage 3.135 3.3 3.465 V IDD XTAL_SEL = 0 Outputs 50Ω to VSS 140 175 mA REF_IN Supply current VDD + VDDO IDD Supply current VDD + XTAL VDDO XTAL_SEL = 1 Outputs 50Ω to VSS 150 185 mA HCSL D ha acteristics (4) ± ± in Typ. Max. Units C Electrical C r V = V DD DDO1/2 = 3.3V 5% or 2.5V 5% VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5% TA = −40°C to +85°C. RL = 50Ω to VSS Symbol Parameter Condition M VOH Output High Voltage 660 700 850 mV VOL Output Low Voltage -150 0 27 mV VCROSS Crossing Point Voltage 250 350 550 mV Notes: 1. Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. The data sheet limits are not guaranteed if the device is operated beyond the operating ratings. 3. Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB. 4. The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established. |
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