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SM802109UMG Datasheet(PDF) 4 Page - Micrel Semiconductor

Part # SM802109UMG
Description  ClockWorks??PCI-e Quad 100MHz Ultra-Low Jitter, HCSL Frequency Synthesizer
Download  11 Pages
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Manufacturer  MICREL [Micrel Semiconductor]
Direct Link  http://www.micrel.com
Logo MICREL - Micrel Semiconductor

SM802109UMG Datasheet(HTML) 4 Page - Micrel Semiconductor

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Micrel, Inc.
SM802109
September 2011
4
M9999-092911-B
hbwhelp@micrel.com or (408) 955-1690
.....
o V
.........
Case Temperature ..................................................... 1
Storage Temperature (Ts) ......................... −65°C to +150°C
tage (VDD, VDDO1/2)............... +2.375V to +3.465V
–40°C to +85°C
Still-Air......................................................... 50°C/W
QFN (
ψJB)
Junction-to-Board ....................................... 30°C/W
acteri
(4)
O
±5
±5% or 2.5V ±5%
=
−40°C
rameter
ion
Min.
Typ.
Max.
Units
Absolute Maximum Ratings
(1)
Supply Voltage (VDD, VDDO1/2)............................
.....+4.6V
Supply Vol
Input Voltage (V ) ..............................
−0.50V t
IN
Lead Temperature (soldering, 20s)...................
DD + 0.5V
260°C
15°C
QFN (
θJA)
Operating Ratings
(2)
Ambient Temperature (TA)..........................
Junction Thermal Resistance
(3)
DC Electrical Char
stics
VDD = VDD 1/2 = 3.3V ±5% or 2.5V
%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V
TA
to
+85°C.
Symbol
Pa
Condit
VDD, VDDO1
o
.37
2.5
2.625
V
/2
2.5V Operating V ltage
2
5
VDD, VDDO1/2
3.3V Operating Voltage
3.135
3.3
3.465
V
IDD
XTAL_SEL = 0
Outputs 50Ω to VSS
140
175
mA
REF_IN
Supply current VDD + VDDO
IDD
Supply current VDD +
XTAL
VDDO
XTAL_SEL = 1
Outputs 50Ω to VSS
150
185
mA
HCSL D
ha acteristics
(4)
±
±
in
Typ.
Max.
Units
C Electrical C
r
V
= V
DD
DDO1/2 = 3.3V
5% or 2.5V 5%
VDD = 3.3V ±5%, VDDO1/2 = 3.3V ±5% or 2.5V ±5%
TA = −40°C to +85°C. RL = 50Ω to VSS
Symbol
Parameter
Condition
M
VOH
Output High Voltage
660
700
850
mV
VOL
Output Low Voltage
-150
0
27
mV
VCROSS
Crossing Point Voltage
250
350
550
mV
Notes:
1.
Permanent device damage may occur if absolute maximum ratings are exceeded. This is a stress rating only and functional operation is not implied
at conditions other than those detailed in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
2.
The data sheet limits are not guaranteed if the device is operated beyond the operating ratings.
3.
Package thermal resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.
4.
The circuit is designed to meet the AC and DC specifications shown in the above table(s) after thermal equilibrium has been established.


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