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Fig. 1 Footprint of the GO1515

DIMENSIONS

SOLDERING RECOMMENDATIONS

Reflow Conditions

The device will meet the data sheet specifications after

completing the reflow process according to the profile

shown in Figure 3 or Figure 4. Do not reflow the device

more than twice.

Endurance To Warp

When the device is soldered on a printed circuit board

(dimension: 100mm x 100mm; thickness: 1.6mm) and the

PCB is warped as shown in Figure 2, the device will not be

cracked or damaged.

Fig. 2 PCB Warp

Soldering Flux

Do not use cleaning type flux. Washing the devices after

using cleaning type flux may damage inner parts and affect

performance.

OUT

NC

GND

GND

65

55

40

40

55

65

45

GND

GND

GO1515

TOP VIEW

All dimensions are in mils

1 mil = 1/1000 inch

GO1515

TOP VIEW

2.0

±0.3

4.2

±0.3

6.0

MAX

1.6±0.5

4.7±0.3

6.3±0.3

7.8 MAX

All dimensions in millimetres.

NC

GND

OUT

GND

GND

GND

2.0 MAX

VCO

PCB

MAX 2mm