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HMC-ALH376 Datasheet(PDF) 3 Page - Hittite Microwave Corporation |
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HMC-ALH376 Datasheet(HTML) 3 Page - Hittite Microwave Corporation |
3 / 6 page 1 1 - 170 For price, delivery, and to place orders, please contact Hittite Microwave Corporation: 20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373 Order On-line at www.hittite.com HMC-ALH376 v02.0209 GaAs HEMT MMIC LOW NOISE AMPLIFIER, 35 - 45 GHz Outline Drawing Absolute Maximum Ratings ELECTROSTATIC SENSITIVE DEVICE OBSERVE HANDLING PRECAUTIONS NOTES: 1. ALL DIMENSIONS ARE IN INCHES [MM]. 2. TYPICAL BOND PAD IS .004” SQUARE. 3. BACKSIDE METALLIZATION: GOLD. 4. BACKSIDE METAL IS GROUND. 5. BOND PAD METALLIZATION: GOLD. 6. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 7. OVERALL DIE SIZE ±.002” Drain Bias Voltage +5.5 Vdc RF Input Power (35 - 40 GHz) -5 dBm RF Input Power (40 - 45 GHz) -1 dBm Channel Temperature 180 °C Storage Temperature -65 to +150 °C Operating Temperature -55 to +85 °C Die Packaging Information [1] Standard Alternate GP-2 (Gel Pack) [2] [1] Refer to the “Packaging Information” section for die packaging dimensions. [2] For alternate packaging information contact Hittite Microwave Corporation. |
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