DAC1408D650HN datasheet(6/98 Pages) NXP

Part #	DAC1408D650HN

Description	Dual 14-bit DAC; up to 650 Msps; 2?? 4??or 8??interpolating with JESD204A interface

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Manufacturer	NXP [NXP Semiconductors]

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DAC1408D650

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Product data sheet

Rev. 4 — 26 November 2010

6 of 98

NXP Semiconductors

DAC1408D650

2

, 4 or 8 interpolating DAC with JESD204A

[1]

P: power supply; G: ground; I: input; O: output.

[2]

H = heatsink (exposed die pad to be soldered to GND. A minimum of 81 thermal vias are required).

7.

Limiting values

8.

Thermal characteristics

[1]

Complies with JEDEC test board, in free air.

VIN_N0

52

I

serial interface lane 0 negative input

VIN_P0

53

I

serial interface lane 0 positive input

VDDD(1V8)

54

P

digital supply voltage 1.8 V

VIN_P1

55

I

serial interface lane 1 positive input

VIN_N1

56

I

serial interface lane 1 negative input

VIN_N2

57

I

serial interface lane 2 negative input

VIN_P2

58

I

serial interface lane 2 positive input

VDDD(1V8)

59

P

digital supply voltage 1.8 V

VIN_P3

60

I

serial interface lane 3 positive input

VIN_N3

61

I

serial interface lane 3 negative input

n.c.

62

-

not connected

n.c.

63

-

not connected

JTAG

64

I

JTAG test mode select (must be grounded)

GND

H[2]

G

ground

Table 2.

Pin description …continued

Symbol

Type[1]

Description

Table 3.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

VDDA(3V3)

analog supply voltage (3.3 V)

0.5

+4.6

V

VDDA(1V8)

analog supply voltage (1.8 V)

0.5

+2.5

V

VDDD

digital supply voltage

0.5

+2.5

V

Tstg

storage temperature

55

+150

C

Tamb

ambient temperature

40

+85

C

Tj

junction temperature

40

+125

C

Table 4.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

Rth(j-a)

thermal resistance from junction to ambient

[1] 18.7

K/W

Rth(j-c)

thermal resistance from junction to case

[1] 6.7

K/W

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