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TJ3966T-5.0V Datasheet(PDF) 10 Page - HTC Korea TAEJIN Technology Co. |
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TJ3966T-5.0V Datasheet(HTML) 10 Page - HTC Korea TAEJIN Technology Co. |
10 / 11 page 3.0A Ultra Low Dropout Linear Regulator TJ3966 Aug. 2010 - Rev. 1.7.1 - 10 - HTC Characteristic Symbol Rating Unit Maximum Allowable Power Dissipation at TA=25°C / SOP8-PP PDMax -SOP8-PP 0.571 W Maximum Allowable Power Dissipation at TA=25°C / TO252 PDMax -TO252 0.952 W Maximum Allowable Power Dissipation at TA=25°C / TO263 PDMax -TO263 1.250 W Maximum Allowable Power Dissipation at TA=25°C / TO220 PDMax -TO220 1.429 W - Please note that above maximum allowable power dissipation is based on the minimum copper plane area which does not exceed the proper footprint of the package. And the ambient temperature is 25°C. If proper cooling solution such as heat sink, copper plane area, air flow is applied, the maximum allowable power dissipation could be increased. However, if the ambient temperature is increased, the allowable power dissipation would be decreased. For example, in case of TO263 package, θJA-TO263 is 80 °C/W, however, as shown in below graph, θJA could be decreased with respect to the copper plane area. So, the specification of maximum power dissipation for an application is fixed, the proper copper plane area could be estimated by following graphs. As shown in graph, wider copper plane area leads lower θJA. The maximum allowable power dissipation is also influenced by the ambient temperature. With the above θJA-Copper plane area relationship, the maximum allowable power dissipation could be evaluated with respect to the ambient temperature. As shown in graph, the higher copper plane area leads θJA. And the higher ambient temperature leads lower maximum allowable power dissipation. |
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