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P500-G200-WH Datasheet(PDF) 5 Page - Bourns Electronic Solutions |
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P500-G200-WH Datasheet(HTML) 5 Page - Bourns Electronic Solutions |
5 / 7 page Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU® P500-G and P850-G Protectors Thermal Resistances Part # Symbol Parameter Value Unit P500-G Rth(j-a) Junction to leads (package) 113 °C/W Junction to leads (per TBU® device) 236 °C/W P850-G Rth(j-a) Junction to leads (package) 119 °C/W Junction to leads (per TBU® device) 215 °C/W Reflow Profile Profile Feature Pb-Free Assembly Average Ramp-Up Rate (Tsmax to Tp) 3 °C/sec. max. Preheat - Temperature Min. (Tsmin) - Temperature Max. (Tsmax) - Time (tsmin to tsmax) 150 °C 200 °C 60-180 sec. Time maintained above: - Temperature (TL) - Time (tL) 217 °C 60-150 sec. Peak/Classification Temperature (Tp) 260 °C Time within 5 °C of Actual Peak Temp. (tp) 20-40 sec. Ramp-Down Rate 6 °C/sec. max. Time 25 °C to Peak Temperature 8 min. max. |
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