6& 6A

4& 4A

1& 1A

3& 3A

6

4

1

3

PIN 1

A

B

D

C

4

6

4A

6A

5

3

1

3A

1A

2

EE

J

J

N

N

H

H

M

G

G

K

F

K

L

L

TOP VIEW

SIDE VIEW

BOTTOM VIEW

PIN 1

A

B

D

C

4

3

6

1

5

2

E

JJ

N

N

H

M

E

K

K

F

TOP VIEW

SIDE VIEW

BOTTOM VIEW

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

Product Dimensions

DIMENSIONS:

MM

(INCHES)

Dim.

P500-G

P850-G

Min.

Typ.

Max.

Min.

Typ.

Max.

A

3.40

(.139)

4.00

(.157)

4.10

(.161)

3.40

(.139)

4.00

(.157)

4.10

(.161)

B

5.90

(.232)

6.00

(.236)

6.10

(.240)

8.15

(.321)

8.25

(.325)

8.35

(.329)

C

0.80

(.031)

0.85

(.033)

0.90

(.035)

0.80

(.031)

0.85

(.033)

0.90

(.035)

D

0.000

(.000)

0.025

(.001)

0.050

(.002)

0.000

(.000)

0.025

(.001)

0.050

(.002)

E

1.15

(.045)

1.25

(.049)

1.35

(.053)

1.15

(.045)

1.25

(.049)

1.35

(.053)

F

1.05

(.041)

1.15

(.045)

1.25

(.049)

1.05

(.041)

1.15

(.045)

1.25

(.049)

G--

--

--

0.725

(.029)

0.825

(.032)

0.925

(.036)

H

1.10

(.043)

1.20

(.047)

1.30

(.051)

1.10

(.043)

1.20

(.047)

1.30

(.051)

J

0.375

(.015)

0.425

(.017)

0.475

(.019)

0.375

(.015)

0.425

(.017)

0.475

(.019)

K

0.70

(.028)

0.75

(.030)

0.80

(.031)

0.25

(.010)

0.30

(.012)

0.35

(.014)

L--

--

--

0.70

(.028)

0.75

(.030)

0.80

(.031)

M

0.70

(.028)

0.75

(.030)

0.80

(.031)

0.70

(.028)

0.75

(.030)

0.80

(.031)

N

0.375

(.015)

0.425

(.017)

0.475

(.018)

0.375

(.015)

0.425

(.017)

0.475

(.018)

Recommended Pad Layout

Pad #

Apply

1

Tip In

2NC

3

Tip Out

4

Ring Out

5NC

6

Ring In

NC = Solder to PCB; do not make electrical

connection, do not connect to ground.

Pad Designation

define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil

opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power

device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini-

mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the

pads of the device.

P500-Gxxx

P850-Gxxx

Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6.

This allows for one PCB layout to accommodate the P500 or P850.

P500-Gxxx

P850-Gxxx

1.225

(.048)

0.75

(.030)

1.15

(.045)

1.275

(.050)

0.375

(.015)

1.225

(.048)

1.25

(.049)

0.85

(.033)

0.30

(.012)

0.75

(.030)

1.15

(.045)

0.375

(.015)

Pad #

Apply

Pad #

Apply

1A

Tip In

4A

Ring Out

1

Tip In

4

Ring Out

2NC

5

NC

3

Tip Out

6

Ring In

3A

Tip Out

6A

Ring In

NC = Solder to PCB; do not make electrical

connection, do not connect to ground.

Pad Designation

Block Diagram

P500-Gxxx

P850-Gxxx