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P500-G120-WH Datasheet(PDF) 4 Page - Bourns Electronic Solutions |
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P500-G120-WH Datasheet(HTML) 4 Page - Bourns Electronic Solutions |
4 / 7 page 6& 6A 4& 4A 1& 1A 3& 3A 6 4 1 3 PIN 1 A B D C 4 6 4A 6A 5 3 1 3A 1A 2 EE J J N N H H M G G K F K L L TOP VIEW SIDE VIEW BOTTOM VIEW PIN 1 A B D C 4 3 6 1 5 2 E JJ N N H M E K K F TOP VIEW SIDE VIEW BOTTOM VIEW Specifications are subject to change without notice. Customers should verify actual device performance in their specific applications. TBU® P500-G and P850-G Protectors Product Dimensions DIMENSIONS: MM (INCHES) Dim. P500-G P850-G Min. Typ. Max. Min. Typ. Max. A 3.40 (.139) 4.00 (.157) 4.10 (.161) 3.40 (.139) 4.00 (.157) 4.10 (.161) B 5.90 (.232) 6.00 (.236) 6.10 (.240) 8.15 (.321) 8.25 (.325) 8.35 (.329) C 0.80 (.031) 0.85 (.033) 0.90 (.035) 0.80 (.031) 0.85 (.033) 0.90 (.035) D 0.000 (.000) 0.025 (.001) 0.050 (.002) 0.000 (.000) 0.025 (.001) 0.050 (.002) E 1.15 (.045) 1.25 (.049) 1.35 (.053) 1.15 (.045) 1.25 (.049) 1.35 (.053) F 1.05 (.041) 1.15 (.045) 1.25 (.049) 1.05 (.041) 1.15 (.045) 1.25 (.049) G-- -- -- 0.725 (.029) 0.825 (.032) 0.925 (.036) H 1.10 (.043) 1.20 (.047) 1.30 (.051) 1.10 (.043) 1.20 (.047) 1.30 (.051) J 0.375 (.015) 0.425 (.017) 0.475 (.019) 0.375 (.015) 0.425 (.017) 0.475 (.019) K 0.70 (.028) 0.75 (.030) 0.80 (.031) 0.25 (.010) 0.30 (.012) 0.35 (.014) L-- -- -- 0.70 (.028) 0.75 (.030) 0.80 (.031) M 0.70 (.028) 0.75 (.030) 0.80 (.031) 0.70 (.028) 0.75 (.030) 0.80 (.031) N 0.375 (.015) 0.425 (.017) 0.475 (.018) 0.375 (.015) 0.425 (.017) 0.475 (.018) Recommended Pad Layout Pad # Apply 1 Tip In 2NC 3 Tip Out 4 Ring Out 5NC 6 Ring In NC = Solder to PCB; do not make electrical connection, do not connect to ground. Pad Designation TBU® devices have matte-tin termination finish. Suggested layout should use non-solder mask define (NSMD). Recommended stencil thickness is 0.10-0.12 mm (.004-.005 in.) with stencil opening size 0.025 mm (.0010 in.) less than the device pad size. As when heat sinking any power device, it is recommended that, wherever possible, extra PCB copper area is allowed. For mini- mum parasitic capacitance, do not allow any signal, ground or power signals beneath any of the pads of the device. P500-Gxxx P850-Gxxx Pads 1A and 1 are internally connected; the same for pads 3A with 3, 4A with 4, and 6A with 6. This allows for one PCB layout to accommodate the P500 or P850. P500-Gxxx P850-Gxxx 1.225 (.048) 0.75 (.030) 1.15 (.045) 1.275 (.050) 0.375 (.015) 1.225 (.048) 1.25 (.049) 0.85 (.033) 0.30 (.012) 0.75 (.030) 1.15 (.045) 0.375 (.015) Pad # Apply Pad # Apply 1A Tip In 4A Ring Out 1 Tip In 4 Ring Out 2NC 5 NC 3 Tip Out 6 Ring In 3A Tip Out 6A Ring In NC = Solder to PCB; do not make electrical connection, do not connect to ground. Pad Designation Block Diagram P500-Gxxx P850-Gxxx |
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