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TJ3966RS-1.2V-3L Datasheet(PDF) 9 Page - HTC Korea TAEJIN Technology Co. |
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TJ3966RS-1.2V-3L Datasheet(HTML) 9 Page - HTC Korea TAEJIN Technology Co. |
9 / 11 page 3.0A Ultra Low Dropout Linear Regulator TJ3966 Aug. 2010 - Rev. 1.7.1 - 9 - HTC Maximum Output Current Capability The TJ3966 can deliver a continuous current of 3.0A over the full operating junction temperature range. However, the output current is limited by the restriction of power dissipation which differs from packages. A heat sink may be required depending on the maximum power dissipation and maximum ambient temperature of application. With respect to the applied package, the maximum output current of 3.0A may be still undeliverable due to the restriction of the power dissipation of TJ3966. Under all possible conditions, the junction temperature must be within the range specified under operating conditions. The temperatures over the device are given by: TC = TA + PD X θCA / TJ = TC + PD X θJC / TJ = TA + PD X θJA where TJ is the junction temperature, TC is the case temperature, TA is the ambient temperature, PD is the total power dissipation of the device, θCA is the thermal resistance of case-to-ambient, θJC is the thermal resistance of junction-to-case, and θJA is the thermal resistance of junction to ambient. The total power dissipation of the device is given by: PD = PIN – POUT = (VIN X IIN)–(VOUT X IOUT) = (VIN X (IOUT+IGND)) – (VOUT X IOUT) = (VIN - VOUT) X IOUT + VIN X IGND where IGND is the operating ground current of the device which is specified at the Electrical Characteristics. The maximum allowable temperature rise (TRmax) depends on the maximum ambient temperature (TAmax) of the application, and the maximum allowable junction temperature (TJmax): TRmax = TJmax – TAmax The maximum allowable value for junction-to-ambient thermal resistance, θJA, can be calculated using the formula: θJA = TRmax / PD = (TJmax – TAmax) / PD TJ3966 is available in SOP8-PP, TO225, TO263 and TO220 packages. The thermal resistance depends on amount of copper area or heat sink, and on air flow. If the maximum allowable value of θJA calculated above is over 175°C/W for SOP8-PP package, over 105 °C/W for TO252 package, over 80 °C/W for TO263 package, over 70 °C/W for TO220 package, no heat sink is needed since the package can dissipate enough heat to satisfy these requirements. If the value for allowable θJA falls near or below these limits, a heat sink or proper area of copper plane is required. In summary, the absolute maximum ratings of thermal resistances are as follow: Absolute Maximum Ratings of Thermal Resistance No heat sink / No air flow / No adjacent heat source / TA = 25°C Characteristic Symbol Rating Unit Thermal Resistance Junction-To-Ambient / SOP8-PP θJA-SOP8-PP 175 °C/W Thermal Resistance Junction-To-Ambient / TO252 θJA-TO252 105 °C/W Thermal Resistance Junction-To-Ambient / TO263 θJA-TO263 80 °C/W Thermal Resistance Junction-To-Ambient / TO220 θJA-TO220 70 °C/W In case that there is no cooling solution and no heat sink / copper plane area for heat sink, the maximum allowable power dissipation of each package is as follow; |
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