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ZMY43 Datasheet(PDF) 1 Page - Diotec Semiconductor |
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ZMY43 Datasheet(HTML) 1 Page - Diotec Semiconductor |
1 / 2 page ZMY3B9G ... ZMY9B1G (1.0 W), ZMY10 2% ... ZMY200 2% (1.3 W) ZMY3B9G ... ZMY9B1G (1.0 W), ZMY10 2% ... ZMY200 2% (1.3 W) Surface Mount Silicon-Zener Diodes Si-Zener-Dioden für die Oberflächenmontage Version 2010-11-25 ZMY...G planar ZMY... non-planar Dimensions - Maße [mm] ZMY3B9G ... ZMY9B1G Nominal Z-voltage – Nominale Z-Spannung 3.9...9.1 V Glass case – Glasgehäuse MELF DO-213AB ZMY10 2% ... ZMY200 2% Nominal Z-voltage – Nominale Z-Spannung 10...200 V Plastic case – Kunststoffgehäuse MELF DO-213AB Weight approx. – Gewicht ca. 0.12 g Plastic material has UL classification 94V-0 Gehäusematerial UL94V-0 klassifiziert Standard packaging taped and reeled Standard Lieferform gegurtet auf Rolle Standard Zener voltage tolerance is graded to the international E 24 (~ ±5%) standard. The devices ZMY3B9G ... ZMY200 2% are specially selected. Die Toleranz der Zener-Spannung ist in der Standard-Ausführung gestuft nach der internationalen Reihe E 24 (~ ±5%). Die Reihe ZMY3B9G ... ZMY200 2% ist eine Sonderselektion. Maximum ratings and Characteristics Grenz- und Kennwerte ZMY3.9G 2% ... ZMY9.1G 2% Power dissipation – Verlustleistung TA = 50°C Ptot 1.0 W 1) Junction temperature – Sperrschichttemperatur Storage temperature – Lagerungstemperatur TJ TS -50...+175°C -50...+175°C Thermal resistance junction to ambient air Wärmewiderstand Sperrschicht – umgebende Luft RthA < 150 K/W 1) Thermal resistance junction to terminal Wärmewiderstand Sperrschicht – Anschluss RthT < 70 K/W ZMY10 2% ... ZMY200 2% Power dissipation – Verlustleistung TA = 50°C Ptot 1.3 W 1) Non repetitive peak power dissipation, t < 10 ms Einmalige Impuls-Verlustleistung, t < 10 ms TA = 25°C PZSM 40 W Junction temperature – Sperrschichttemperatur Storage temperature – Lagerungstemperatur TJ TS -50...+150°C -50...+175°C Thermal resistance junction to ambient air Wärmewiderstand Sperrschicht – umgebende Luft RthA < 45 K/W 1) Thermal resistance junction to terminal Wärmewiderstand Sperrschicht – Anschluss RthT < 10 K/W 2 1 Mounted on P.C. board with 50 mm2 copper pads at each terminal Montage auf Leiterplatte mit 50 mm2 Kupferbelag (Lötpad) an jedem Anschluss 2 Tested with pulses – Gemessen mit Impulsen © Diotec Semiconductor AG http://www.diotec.com/ 1 |
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