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For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Outline Drawing

Absolute Maximum Ratings

RF / IF Input

+15 dBm

LO Drive

+27 dBm

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

IF DC Current

±4 mA

ESD Sensitivity (HBM)

Class 1A

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM].

2. DIE THICKNESS IS .004”.

3. TYPICAL BOND PAD IS .004” SQUARE.

4. BOND PAD SPACING CENTER TO CENTER IS .006”.

5. BACKSIDE METALLIZATION: GOLD.

6. BOND PAD METALLIZATION: GOLD.

7. BACKSIDE METAL IS GROUND.

8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.

Standard

Alternate

GP-5 (Gel Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

ELECTROSTATIC SENSITIVE DEVICE

OBSERVE HANDLING PRECAUTIONS

HMC260

v04.1007

GaAs MMIC FUNDAMENTAL

MIXER, 14 - 26 GHz