7

7 - 4

For price, delivery and to place orders: Hittite Microwave Corporation, 20 Alpha Road, Chelmsford, MA 01824

Phone: 978-250-3343

Fax: 978-250-3373

Order On-line at www.hittite.com

Application Support: Phone: 978-250-3343 or apps@hittite.com

Outline Drawing

NOteS:

1. DiMeNSiONS iN iNcheS [MiLLiMeteRS].

2. Die thicKNeSS iS 0.005”.

3. tYpicAL BOND pAD iS 0.004” SQUARe.

4. tYpicAL BOND pAD SpAciNG iS 0.006” ceNteR tO ceNteR.

5. BOND pAD MetALLiZAtiON: GOLD.

6. pADS 4 AND 6 MUSt Be cONNecteD tO RF/Dc GROUND.

Pad Descriptions

pad Number

Function

Description

interface Schematic

1, 7

A, A (alt.)

See truth table and control voltage table.

connect either pad 1 or pad 7 to control logic input.

2, 5, 8

RF1, RFc, RF2

these pads are Dc coupled and matched to 50 Ohms.

Blocking capacitors are required.

3, 9

B, B (alt.)

See truth table and control voltage table.

connect either pad 3 or pad 9 to control logic input.

4, 6

Ac GND

Must be connected to RF/Dc ground.

Standard

Alternate

Gp-5 (Gel-pak®)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

HMC240A

v00.0211

GaAs MMIC SPDT SWITCH

DC - 4 GHz