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SPI-8003TW Datasheet(PDF) 4 Page - Sanken electric |
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SPI-8003TW Datasheet(HTML) 4 Page - Sanken electric |
4 / 4 page 61 ICs SPI-8001TW/SPI-8002TW/SPI-8003TW ■Typical Connection Diagram VIN GND VC/E VCC 3 VIN1 SWout1 R5 C4 C1 C6 + 24 SS1 6 11 DGND1 5 VIN2 15 SS2 DGND2 12 7 VREF1 13 SWout2 10 VREF2 R6 C5 C/E AGND Ch2 Ch1 14 1, 9 Di2 L2 IREF2 C3 V02 C8 + GND Di1 L1 IREF1 C2 R1 R2 R3 R4 V01 C7 + SPI-8000TW Diodes Di1, Di2 • Be sure to use Schottky-barrier diodes for Di1 and Di2. If other diodes like fast recovery diodes are used, IC may be destroyed because of the reverse voltage generated by the recovery voltage or ON voltage. Choke coils L1, L2 • If the winding resistance of the choke coil is too high, the efficiency may drop below the rated value. • As the overcurrent protection starting current is about 2.0A, take care concerning heat radiation from the choke coil caused by magnetic saturation due to overload or short-circuited load. • Use a closed-magnetic-path coil to prevent interference between the channels SWout1 and SWout2. Capacitors C1, C2, C3 • As large ripple currents flow through C1, C2 and C3, use high-frequency and low-impedance capacitors suitable for switching mode power supplies. Especially when the impedance of C2 and C3 are high, the switching waveforms may become abnormal at low temperatures. For C2 and C3, do not use capacitors with extremely low equivalent series resistance (ESR) such as OS capacitors or tantalum capacitors, which may cause abnormal oscillation. Resistors R1, R2, R3, R4 • R1, R2, R3 and R4 are resistors for setting output voltages. Set the resistors so that IREF is approx. 1 mA. For example, R1 and R2 can be calculated as shown below. (VO1–VREF1)(VO1–V) VREF1 1 R1= IREF1 = 1×10–3 (Ω), R2= IREF1 = 1×10–3 1(KΩ) To create the optimum operating conditions, place the components as close as possible to each other. C1 : 220 µF/50V C2, C3 : 470 µF/25V C4, C5 : 1 µF C6, C7, C8 : 0.1 µF Note 1: The efficiency depends on the input voltage and the output current. Therefore, obtain the value from the efficiency graph and substitute the percent- age in the formula above. Note 2: Thermal design for D1 must be considered separately. ■Ta-PD Characteristics VO : Output Voltage VIN : Input Voltage IO : Output Current ηχ : Efficiency (%) VF :D1 Forward Voltage SJPB-H6···0.45V (IO=1A) PD = VO·IO 100 –1 – VF·IO 1– VO ηχ VIN –25 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 025 50 75 100 125 135 150 Ambient Temperature Ta (°C) 69.2°C/W (0.84 cm 2) 52.3°C/W (3.34 cm 2) 42.6°C/W (8.64 cm 2) 35.8°C/W (30.8 cm 2) (Copper Laminate Area) θ j-a 38.2°C/W (15.6 cm 2) = . . VIN GND VC/F VCC 3 VIN1 SWout1 R5 C5 C1 C4 C9 R7 + 24 SS1 6 12 DGND1 5 VIN2 16 SS2 DGND2 13 7 VREF1 14 SWout2 11 VREF2 R6 C6 C/E AGND CORC RCSC Ch2 Ch1 15 1, 9 10 Di2 L2 IREF2 C3 VC2 C8 + GND Di1 L1 IREF1 C2 R1 R2 R3 R4 VC1 C7 + 8 SPI-8003TW R5, R6 : 1kΩ L1, L2 : 47 µH Di1, Di2 : SJPB-H6 (Sanken) C1 : 220 µF/50V C2, C3 : 470 µF/25V C4 : 1 µF/50V C5, C6 : 1 µF/10V C7, C8 : 0.1 µF/50V C9 : 100pF/10V L1, L2 : 47 µH R2, R4 : 1kΩ R5, R6 : 1kΩ Di1, Di2 : SJPB-H6 (Sanken) |
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