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MAX11632EEG+ Datasheet(PDF) 2 Page - Maxim Integrated Products

Part # MAX11632EEG+
Description  12-Bit, 300ksps ADCs with FIFO and Internal Reference
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Manufacturer  MAXIM [Maxim Integrated Products]
Direct Link  https://www.maximintegrated.com/en.html
Logo MAXIM - Maxim Integrated Products

MAX11632EEG+ Datasheet(HTML) 2 Page - Maxim Integrated Products

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12-Bit, 300ksps ADCs
with FIFO and Internal Reference
2
_______________________________________________________________________________________
ABSOLUTE MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
(VDD = +2.7V to +3.6V (MAX11627/MAX11629/MAX11633); VDD = +4.75V to +5.25V (MAX11626/MAX11628/MAX11632), fSAMPLE =
300kHz, fSCLK = 4.8MHz (50% duty cycle), VREF = 2.5V (MAX11627//MAX11629/MAX11633); VREF = 4.096V (MAX11626/MAX11628/
MAX11632), TA = TMIN to TMAX, unless otherwise noted. Typical values are at TA = +25°C.)
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional
operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to
absolute maximum rating conditions for extended periods may affect device reliability.
VDD to GND ..............................................................-0.3V to +6V
CS, SCLK, DIN, EOC, DOUT to GND.........-0.3V to (VDD + 0.3V)
AIN0–AIN13, AIN_, CNVST/AIN_,
REF to GND ...........................................-0.3V to (VDD + 0.3V)
Maximum Current into Any Pin............................................50mA
Continuous Power Dissipation (TA = +70°C)
16-Pin QSOP (derate 8.3mW/°C above +70°C)...........667mW
24-Pin QSOP (derate 9.5mW/°C above +70°C)...........762mW
Operating Temperature Range ...........................-40°C to +85°C
Storage Temperature Range .............................-60°C to +150°C
Junction Temperature ......................................................+150°C
Lead Temperature (soldering, 10s) .................................+300°C
Soldering Temperature (reflow) .......................................+260°C
PARAMETER
SYMBOL
CONDITIONS
MIN
TYP
MAX
UNITS
DC ACCURACY (Note 1)
Resolution
RES
12
Bits
Integral Nonlinearity
INL
±1.0
LSB
Differential Nonlinearity
DNL
No missing codes over temperature
±1.0
LSB
Offset Error
±0.5
±4.0
LSB
Gain Error
(Note 2)
±0.5
±4.0
LSB
Offset Error Temperature
Coefficient
±2
ppm/°C
FSR
Gain Temperature Coefficient
±0.8
ppm/°C
Channel-to-Channel Offset
Matching
±0.1
LSB
DYNAMIC SPECIFICATIONS (30kHz sine-wave input, 2.5VP-P, 300ksps, fSCLK = 4.8MHz)
MAX11627/MAX11629/MAX11633
71
Signal-to-Noise Plus Distortion
SINAD
MAX11626/MAX11628/MAX11632
73
dB
MAX11627/MAX11629/
MAX11633
-80
Total Harmonic Distortion
THD
Up to the 5th
harmonic
MAX11626/MAX11628/
MAX11632
-88
dBc
MAX11627/MAX11629/MAX11633
81
Spurious-Free Dynamic Range
SFDR
MAX11626/MAX11628/MAX11632
89
dBc
Intermodulation Distortion
IMD
fIN1 = 29.9kHz, fIN2 = 30.2kHz
76
dBc
Full-Power Bandwidth
-3dB point
1
MHz
Full-Linear Bandwidth
S/(N + D) > 68dB
100
kHz


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