LPC4310FBD144 datasheet(3/145 Pages) NXP

Part #	LPC4310FBD144

Description	32-bit ARM Cortex-M4/M0 MCU; up to 264 kB SRAM; Ethernet two High-speed USBs; advanced configurable peripherals

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Manufacturer	NXP [NXP Semiconductors]

Direct Link	http://www.nxp.com

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LPC4350_30_20_10

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Objective data sheet

Rev. 2.1 — 23 September 2011

3 of 145

NXP Semiconductors

LPC4350/30/20/10

32-bit ARM Cortex-M4/M0 microcontroller

 LCD controller with DMA support and a programmable display resolution of up to

1024H

 768V. Supports monochrome and color STN panels and TFT color panels;

supports 1/2/4/8 bpp Color Look-Up Table (CLUT) and 16/24-bit direct pixel

mapping.

 Secure Digital Input Output (SD/MMC) card interface.

 Eight-channel General-Purpose DMA (GPDMA) controller can access all memories

on the AHB and all DMA-capable AHB slaves.

 Up to 164 General-Purpose Input/Output (GPIO) pins with configurable

pull-up/pull-down resistors and open-drain mode.

 GPIO registers are located on the AHB for fast access. GPIO ports have DMA

support.

 Up to eight GPIO pins can be selected from all GPIO pins as edge and level

sensitive interrupt sources.

 Two GPIO group interrupt modules enable an interrupt based on a programmable

pattern of input states of a group of GPIO pins.

 Four general-purpose timer/counters with capture and match capabilities.

 One motor control Pulse Width Modulator (PWM) for three-phase motor control.

 One Quadrature Encoder Interface (QEI).

 Repetitive Interrupt timer (RI timer).

 Windowed watchdog timer (WWDT).

 Ultra-low power Real-Time Clock (RTC) on separate power domain with 256 bytes

of battery powered backup registers.

 Alarm timer; can be battery powered.

 Analog peripherals

 One 10-bit DAC with DMA support and a data conversion rate of 400 kSamples/s.

 Two 10-bit ADCs with DMA support and a data conversion rate of 400 kSamples/s.

ADC inputs are shared between the two ADCs.

 Security

 AES engine programmable through an on-chip API.

 Two 128-bit secure OTP memories for AES key storage and customer use.

 Unique ID for each device.

 Clock generation unit

 Crystal oscillator with an operating range of 1 MHz to 25 MHz.

 12 MHz Internal RC (IRC) oscillator trimmed to 1 % accuracy over temperature and

voltage.

 Ultra-low power Real-Time Clock (RTC) crystal oscillator.

 Three PLLs allow CPU operation up to the maximum CPU rate without the need for

a high-frequency crystal. The second PLL is dedicated to the High-speed USB, the

third PLL can be used as audio PLL.

 Clock output.

 Power

 Single 3.3 V (2.2 V to 3.6 V) power supply with on-chip DC-to-DC converter for the

core supply and the RTC power domain.

 RTC power domain can be powered separately by a 3 V battery supply.

 Four reduced power modes: Sleep, Deep-sleep, Power-down, and Deep

power-down.

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