XLAMP MP-L EASYWHITE LEDS

Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

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Copyright © 2010 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree, the Cree logo and XLamp are registered trademarks

of Cree, Inc.

10

notes

lumen maintenance Projections

Based on internal long-term reliability testing, Cree projects XLamp MP-L easyWhite LeDs to maintain a mean 70%

lumen maintenance after 50,000 hours at maximum rated drive current, provided the LED solder point temperature is

maintained at or below 85°C.

Please read the XLamp Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance

testing and forecasting. Please read the XLamp Thermal Management application note for details on how thermal design,

ambient temperature, and drive current affect the LeD junction temperature.

moisture sensitivity

XLamp MP-L easyWhite LeDs are shipped in sealed, moisture-

barrier bags (MBB) designed for long shelf life. If XLamp MP-L

easyWhite LeDs are exposed to moist environments after open-

ing the MBB packaging but before soldering, damage to the

LeD may occur during the soldering operation. The following

derating table defines the maximum exposure time (in days)

for an XLamp MP-L easyWhite LeD in the listed humidity and

temperature conditions. LEDs with exposure time longer than the time specified below must be baked according to the

baking conditions listed below.

Baking conditions

It is not necessary to bake all XLamp MP-L easyWhite LeDs. Only the LeDs that meet all of the following criteria must

be baked:

1. LeDs that have been removed from the original MBB packaging

2. LeDs that have been exposed to a humid environment longer than listed in the Moisture Sensitivity section above

3. LeDs that have not been soldered

LeDs should be baked at 80ºC for 24 hours. LeDs may be baked on the original reels. Remove LeDs from MBB packaging

before baking. Do not bake parts at temperatures higher than 80ºC. This baking operation resets the exposure time as

defined in the Moisture Sensitivity section above.

temp.

maximum Percent relative humidity

30%

40%

50%

60%

70%

80%

90%

35ºC

-

-

-

17

1

.5

.5

30ºC

-

-

-

28

1

1

1

25ºC

-

-

-

-

2

1

1

20ºC

-

-

-

-

2

1

1