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TMS570LS3137 Datasheet(PDF) 8 Page - Texas Instruments |
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TMS570LS3137 Datasheet(HTML) 8 Page - Texas Instruments |
8 / 159 page FullPart# TMS 570 LS 31 3 7 A ZWT Q Q1 R OrderablePart# TMX 570 31 3 7 A ZWT Q Q1 R Prefix: TM TMS=FullyQualified TMP =Prototype TMX=Samples Core Technology: 570=CortexR4F Architecture: LS=DualCPUsinLockstep (notincludedinorderablepart#) FlashMemorySize: 31=3MB RAMMemorySize: 3=256kB PeripheralSet: 7=FlexRay,Ethernet DieRevision: Blank=InitialDie A =1stDieRevision Package Type: ZWT =337BGA Package PGE=144PinPackage TemperatureRange: Q=-40...+125 C o QualityDesignator: Q1= Automotive ShippingOptions: R= TapeandReel TMS570LS3137 SPNS162. – SEPTEMBER 2011 www.ti.com The figure below illustrates the numbering and symbol nomenclature for the TMS570LS3137 . Figure 1-1. TMS570LS3137 Device Numbering Conventions 1.1.2 Orderable Part Numbers Table 1-1. Orderable Part Numbers Orderable Part # Part # Flash RAM EMAC FlexRay TMX5703137APGEQQ1 TMS570LS3137 3MB 256kB 10/100 2ch TMX5703137AZWTQQ1 TMS570LS3137 3MB 256kB 10/100 2ch 8 Contents Copyright © 2011, Texas Instruments Incorporated Submit Documentation Feedback focus.ti.com: TMS570LS3137 |
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