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BU4924 Datasheet(PDF) 7 Page - Rohm |
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BU4924 Datasheet(HTML) 7 Page - Rohm |
7 / 9 page Technical Note 7/8 BU48□□G Series, BU48□□F Series, BU48□□FVE Series, BU49□□G Series, BU49□□F Series, BU49□□FVE Series www.rohm.com 2011.03 - Rev.D © 2011 ROHM Co., Ltd. All rights reserved. ● Notes for use 1. Absolute maximum range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2. GND potential GND terminal should be a lowest voltage potential every state. Please make sure all pins that are over ground even if include transient feature. 3 Electrical Characteristics Be sure to check the electrical characteristics that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4. Bypass Capacitor for Noise Rejection Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5. Short Circuit between Terminal and Soldering Don’t short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6. Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7. The Vdd line inpedance might cause oscillation because of the detection current. 8. A Vdd -GND capacitor (as close connection as possible) should be used in high Vdd line impedance condition. 9. Lower than the mininum input voltage makes the Vout high impedance, and it must be Vdd in pull up (Vdd) condition. 10. Recommended value of RL Resistar is over 10kΩ (VDET=1.5V~4.8V), over 100kΩ (VDET=0.9~1.4V). 11. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10MΩ leakage is assumed between the CT terminal and the GND terminal, 1MΩ connection between the CT terminal and the Vdd terminal would be recommended. Also, if the leakage is assumed between the Vout terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. 12. External parameters For Rl, the recommended range is 10kΩ~1MΩ. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 13. Power on reset operation Please note that the power on reset output varies with the Vcc rise up time. Please verify the actual operation. 14. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation.To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 15. When the power supply, is turned on because of incertain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. |
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