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BD3538F Datasheet(PDF) 9 Page - Rohm |
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BD3538F Datasheet(HTML) 9 Page - Rohm |
9 / 11 page Technical Note BD3538F,BD3538HFN 9/10 www.rohm.com 2010.05 - Rev.A © 2010 ROHM Co., Ltd. All rights reserved. 0 100 200 300 400 500 600 700 800 0 25 50 75 100 125 150 Ambient Temperature:Ta(℃) (2) 560mW (1) 690mW 100℃ 0.0 0.5 1.0 1.5 2.0 0 25 50 75 100 125 150 Ambient Temperature:Ta(℃) (3) 0.63W (2) 1.35W (1) 1.75W (1) 1 layer (copper foil density : 65%) θ ja=71.4℃/W (2) 1 layer (copper foil density : 7%) θ ja=92.4℃/W (3) 1 layer (copper foil density : 0.2%) θ ja=198.4℃/W ● Heat Loss Thermal design must be conducted with the operation under the conditions listed below (which are the guaranteed temperature range requiring consideration on appropriate margins etc.): 1. Ambient temperature Ta: 100°C or lower 2. Chip junction temperature Tj: 150°C or lower The chip junction temperature Tj can be considered as follows. See Page 2/10 for θja. For the package has FIN at the bottoms of IC, package power depends on the connected copper foil area. Be sure to keep the board surface area or release the heat with setting enough through holes to inside pattern. Most of heat loss in BD3538F/HFN occurs at the output N-channel FET. The power lost is determined by multiplying the voltage between VIN and Vo by the output current. As this IC employs the power PKG, the thermal derating characteristics significantly depends on the pc board conditions. When designing, care must be taken to the size of a pc board to be used. Power dissipation (W) = {Input voltage (VTT_IN) – Output voltage (VTT=1/2VDDQ)}×Io (Ave) If VTT_IN = 1.8 volts, VDDQ=1.8 volts, and Io (Ave)=0.5 A, for instance, the power dissipation is determined as follows: Power dissipation (W) = {1.8 (V) – 0.9 (V)} × 0.5 (A) = 0.4 (W) ● Power Dissipation ◎ SOP8 ◎ HSON8 (1) 70mm×70mm×1.6mm Glass-epoxy PCB θ j-c=181℃/W (2) With no heat sink θ j-a=222℃/W |
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