1V to 16V, Single-Channel, Hot-Swap Controllers

with Precision Current-Sensing Output

2

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional

operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect device reliability.

PWR, SENSE, IN, FCOMP, SCOMP,

GATE, SOURCE, CALSENSE to GND ...............-0.3V to +28V

PG, CAL, BIAS, UV, OV, FAULT, CSOUT to GND..-0.3V to +6V

REG to GND............................................................-0.3V to +4V

GATE to SOURCE ...................................................-0.3V to +6V

IN to FCOMP, IN to SCOMP, IN to SENSE,

IN to CALSENSE ..................................................-0.3V to +1V

GND to AGND......................................................-0.3V to +0.3V

FAULT, PG Current ........................................... -1mA to +50mA

GATE, SOURCE, GND Current ........................................750mA

Input/Output Current (all other pins)..................................20mA

20-Pin TQFN, Single-Layer Board

(derate 16.9mW/NC above +70NC)..........................1355.9mW

20-Pin TQFN, Multilayer Board

(derate 25.6mW/NC above +70NC)..........................2051.3mW

Junction-to-Ambient Thermal Resistance (Note 1)

B

B

Junction-to-Case Thermal Resistance (Note 1)

B

Operating Temperature Range.......................... -40NC to +85NC

Junction Temperature .....................................................+150NC

Storage Temperature Range............................ -65NC to +150NC

Lead Temperature (soldering, 10s) ................................+300NC

Soldering Temperature (reflow) ......................................+260NC

ABSOLUTE MAXIMUM RATINGS

Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-

layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.

ELECTRICAL CHARACTERISTICS

PARAMETER

SYMBOL

CONDITIONS

MIN

TYP

MAX

UNITS

Operating Voltage Range

2.7

3.3

16

V

Undervoltage Lockout

Minimum rising voltage on PWR

2.69

V

Undervoltage-Lockout Hysteresis

100

mV

Supply Current

0.734

4

mA

Internal LDO Output Voltage

2.49

2.6

V

CURRENT-MONITORING FUNCTION

IN Input Range

Common-mode range

1

16

V

SCOMP Input Range

1

16

V

FCOMP Input Range

1

16

V

IN Input Current

135

F

A

SENSE Input Current

6

F

A

Circuit-Breaker Current (Slow

Comparator)

24.0

25

26.0

F

A

Circuit-Breaker Current (Fast

Comparator)

48.1

50

51.4

F

A

Slow Current-Limit Threshold

Error

-2.0

+2.1

mV

Fast Current-Limit Threshold Error

-2.2

+1.4

mV

Slow-Comparator Response Time

1mV overdrive

1

ms

50mV overdrive

130

F

s

Fast-Comparator Response Time

10mV overdrive, from overload condition,

200

ns