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MAX5977A Datasheet(PDF) 2 Page - Maxim Integrated Products |
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MAX5977A Datasheet(HTML) 2 Page - Maxim Integrated Products |
2 / 13 page 1V to 16V, Single-Channel, Hot-Swap Controllers with Precision Current-Sensing Output 2 Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. PWR, SENSE, IN, FCOMP, SCOMP, GATE, SOURCE, CALSENSE to GND ...............-0.3V to +28V PG, CAL, BIAS, UV, OV, FAULT, CSOUT to GND..-0.3V to +6V REG to GND............................................................-0.3V to +4V GATE to SOURCE ...................................................-0.3V to +6V IN to FCOMP, IN to SCOMP, IN to SENSE, IN to CALSENSE ..................................................-0.3V to +1V GND to AGND......................................................-0.3V to +0.3V FAULT, PG Current ........................................... -1mA to +50mA GATE, SOURCE, GND Current ........................................750mA Input/Output Current (all other pins)..................................20mA Continuous Power Dissipation (TA = +70NC) 20-Pin TQFN, Single-Layer Board (derate 16.9mW/NC above +70NC)..........................1355.9mW 20-Pin TQFN, Multilayer Board (derate 25.6mW/NC above +70NC)..........................2051.3mW Junction-to-Ambient Thermal Resistance (Note 1) B JA, Single-Layer Board ........................................... +59NC/W B JA, Multilayer Board ................................................ +39NC/W Junction-to-Case Thermal Resistance (Note 1) B JC, Single-Layer and Multilayer Board...................... +6NC/W Operating Temperature Range.......................... -40NC to +85NC Junction Temperature .....................................................+150NC Storage Temperature Range............................ -65NC to +150NC Lead Temperature (soldering, 10s) ................................+300NC Soldering Temperature (reflow) ......................................+260NC ABSOLUTE MAXIMUM RATINGS Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four- layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial. ELECTRICAL CHARACTERISTICS (VPWR = VIN = 12V, RSENSE = 4mI, RFCOMP = RSCOMP = 2kI, RGATE = 1kI, CGATE = 330nF, CREG = 1FF, unless otherwise noted. Typical Values at VPWR = VIN = 3.3V, TA = +25NC, unless otherwise noted.) (Note 2) PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Operating Voltage Range VPWR 2.7 3.3 16 V Undervoltage Lockout VUVLO Minimum rising voltage on PWR 2.69 V Undervoltage-Lockout Hysteresis VUVLOHYS 100 mV Supply Current IPWR 0.734 4 mA Internal LDO Output Voltage VREG 2.7V < VPWR < 16V, 0 to 1mA 2.49 2.6 V CURRENT-MONITORING FUNCTION IN Input Range Common-mode range 1 16 V SCOMP Input Range 1 16 V FCOMP Input Range 1 16 V IN Input Current 135 F A SENSE Input Current VIN = VSENSE = 1V to 16V 6 F A Circuit-Breaker Current (Slow Comparator) ISCOMP VSCOMP = 1V to 16V 24.0 25 26.0 F A Circuit-Breaker Current (Fast Comparator) IFCOMP VFCOMP = 1V to 16V 48.1 50 51.4 F A Slow Current-Limit Threshold Error VSENSE - VSCOMP = 50mV -2.0 +2.1 mV Fast Current-Limit Threshold Error VSENSE - VFCOMP = 100mV -2.2 +1.4 mV Slow-Comparator Response Time tSCD 1mV overdrive 1 ms 50mV overdrive 130 F s Fast-Comparator Response Time tFSD 10mV overdrive, from overload condition, VPWR = 12V 200 ns |
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Similar Description - MAX5977A |
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